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Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
PowerPC 750 Package
Package Type
Ceramic Ball Grid Array (CBGA)
Package outline
25 x 25mm
Interconnects
360 (19 x 19 ball array - 1)
Pitch
1.27mm (50mil)
Minimum module height
2.65mm
Maximum module height
3.20mm
Ball diameter
0.89mm (35mil)
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