參數(shù)資料
型號(hào)： IBM25PPC740L-GB300A2T
英文描述： MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
中文描述： 微處理器| 32位|的CMOS | BGA封裝| 255PIN |陶瓷
文件頁(yè)數(shù)： 44/50頁(yè)
文件大?。?/td> 516K
代理商： IBM25PPC740L-GB300A2T
Page 40
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
The board designer can choose between several types of heat sinks to place on the 750. There are several
commercially-available heat sinks for the 750 provided by the following vendors:
Chip Coolers, Inc.
333 Strawberry Field Rd.
Warwick, RI 02887-6979
800-227-0254 (USA/Canada)
401-739-7600
Thermalloy
2021 W. Valley View Lane
P.O. Box 810839
Dallas, TX 75731
214-243-4321
International Electronic Research Corporation (IERC)
135 W. Magnolia Blvd.
Burbank, CA 91502
818-842-7277
Aavid Engineering
One Kool Path
Laconic, NH 03247-0440
603-528-3400
Wakefield Engineering
60 Audubon Rd.
Wakefield, MA 01880
617-245-5900
Ultimately, the final selection of an appropriate heat sink for the 750 depends on many factors, such as ther-
mal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table “Package Thermal Characteristics1,” on page 8,
the intrinsic conduction thermal resistance paths are as follows.
Die junction-to-case thermal resistance
Die junction-to-ball thermal resistance
Figure 21 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
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