參數(shù)資料
型號(hào): IBM25CPC700BB3B66
英文描述: Peripheral (Multifunction) Controller
中文描述: 周邊(多功能)控制器
文件頁(yè)數(shù): 10/50頁(yè)
文件大小: 516K
代理商: IBM25CPC700BB3B66
Page 6
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
General Parameters
The following list provides a summary of the general parameters of the 750.
Technology
0.20
μ
m CMOS (general lithography), six-layer copper metallization
0.12
±
0.04
μ
m L
eff
Die Size
5.14mm x 7.78mm (40mm
2
)
Transistor count
6.35 million
Logic design
Fully-static
Package
740: Surface mount 21x21mm, 255-lead ceramic ball grid array (CBGA)
750: Surface mount 25x25mm, 360-lead ceramic ball grid array (CBGA)
PPC 740/PPC 750 core
power supply
2v Nominal
I/O power supply
3.3V
±
5%
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