參數(shù)資料
型號(hào): I1810P
廠商: WINBOND ELECTRONICS CORP
元件分類: 音頻合成
英文描述: SINGLE-CHIP, SINGLE-MESSAGE VOICE RECORD/PLAYBACK DEVICE 6- TO 16-SECOND DURATION
中文描述: 960 SEC, SPEECH SYNTHESIZER WITH RCDG, PDIP28
封裝: 0.600 INCH, PLASTIC, DIP-28
文件頁(yè)數(shù): 4/26頁(yè)
文件大小: 709K
代理商: I1810P
I1800 SERIES
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM .............................................................................................................................. 3
4. TABLE OF CONTENTS...................................................................................................................... 4
5. PIN CONFIGURATION....................................................................................................................... 5
6. PIN DESCRIPTION............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION............................................................................................................ 9
7.1. Detailed Description
.................................................................................................................. 9
7.2. Functional Description Example
........................................................................................... 10
8. TIMING DIAGRAMS.......................................................................................................................... 12
9. ABSOLUTE MAXIMUM RATINGS
[1]
................................................................................................ 15
9.1 Operating Conditions
............................................................................................................... 16
10. ELECTRICAL CHARACTERISTICS............................................................................................... 17
10.1. DC Parameters
...................................................................................................................... 17
10.2. AC Parameters
[1]
................................................................................................................... 18
11. TYPICAL APPLICATION CIRCUIT................................................................................................. 19
12. PACKAGE DRAWING AND DIMENSIONS.................................................................................... 20
12.1. 28-Lead 300mil Small Outline IC (SOIC) Package
.......................................................... 20
12.2. 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) – For Sampling Only
........... 21
12.3. I1800 Bonding Physical Layout (Die)
................................................................................. 22
13. ORDERING INFORMATION........................................................................................................... 24
14. VERSION HISTORY ....................................................................................................................... 25
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