參數(shù)資料
型號: HYS72T64400HFA-3S-B
廠商: QIMONDA AG
元件分類: DRAM
英文描述: 240-Pin Fully-Buffered DDR2 SDRAM Modules
中文描述: 64M X 72 DDR DRAM MODULE, DMA240
封裝: GREEN, DIMM-240
文件頁數(shù): 40/47頁
文件大小: 1378K
代理商: HYS72T64400HFA-3S-B
HYS72T[64/128/256]4[00/20]HFA–[2.5/3S/3.7]–B
Fully-Buffered DDR2 SDRAM Modules
Internet Data Sheet
Rev.1.01, 2007-06-20
10062006-RQWY-GI6S
40
7
Package Outline
All Components are surface mounted on one or both sides of
the PCB and positioned on the PCB to meet the minimum and
maximum trace lengths required for DDR2 SDRAM signals.
Bypass capacitors for DDR2 SDRAM devices are located
near the device power pins. The AMB device in the center of
the DIMM has a metal Heat Sink.
TABLE 19
Raw Card Reference
1) Thickness includes Heat Sink. Some early production modules with Heatspreader may be thicker up to 8.2mm.
2) Please contact your sales or marketing representative for more details on package dimensions
3) Drawing according to ISO 8015.
4) Dimensions in mm.
5) General tolerances +/- 0.15.
Attention: Heat Sink heat up during operation. When unplugging a DIMM from a system direct skin contact should be
avoided until the Heat Sink has reached room temperature.
Attention: The Heat Sink is mechanically loaded. Do not remove. Removal of the clip may cause injuries.
Attention: Any mechanical stress on the Heat Sink should be avoided. Touching the Heat Sink while plugging or
unplugging the module may permanently damage the DIMM.
PCB
Dimensions
Width [mm]
Height [mm]
Thickness [mm]
Notes
L-DIM-240-21
L-DIM-240-22
L-DIM-240-25
Figure 4
Figure 5
Figure 6
133.35
133.35
133.35
30.35
30.35
30.35
8.2
8.2
8.2
1)2)3)4)5)
1)2)3)4)5)
1)2)3)4)5)
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