參數(shù)資料
型號(hào): HYE25L256160AC-75
廠商: INFINEON TECHNOLOGIES AG
英文描述: SMP(M)PIN CONT,PCB REAR MNT
中文描述: 256兆移動(dòng)RAM
文件頁(yè)數(shù): 5/55頁(yè)
文件大小: 1053K
代理商: HYE25L256160AC-75
Data Sheet
5
V1.1, 2003-04-16
HYE25L256160AC
256-Mbit Mobile-RAM
Overview
interleave fashion allows random access operation to occur at higher rate. A sequential and gapless data rate is
possible depending on burst length, CAS latency and speed grade of the device.
The Mobile-RAM is housed in a FBGA “chip-size” package. The Mobile-RAM is available in the extended (–25 °C
to +85 °C) temperature range.
Table 2
Part Number
1)
HYE25L256160AC–7.5
HYE25L256160AC–8
Ordering Information
1) HYB/E: designator for memory components for commercial/extended temperature range
25L:
Mobile-RAM
at
V
DD
= 2.5 V
256: 256-Mbit density
160: Product variation x16
A: Die revision A
C: Package type FBGA
7.5/8: speed grade - see
Table 1
Function Code
PC133–333–522
PC100–222–620
Case Temperature Range
extended (–25 °C to +85 °C)
Package
P-TFBGA-54
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HYE25L256160AC-8 制造商:INFINEON 制造商全稱(chēng):Infineon Technologies AG 功能描述:256-Mbit Mobile-RAM
HYE25L256160AF 制造商:INFINEON 制造商全稱(chēng):Infineon Technologies AG 功能描述:256MBit Mobile-RAM
HYE25L256160AF-7.5 制造商:INFINEON 制造商全稱(chēng):Infineon Technologies AG 功能描述:BJAWBMSpecialty DRAMs Mobile-RAM
HYE25L256160AF-75 制造商:INFINEON 制造商全稱(chēng):Infineon Technologies AG 功能描述:256MBit Mobile-RAM