參數(shù)資料
型號(hào): HY62UF16804A-SM70I
廠商: HYNIX SEMICONDUCTOR INC
元件分類: SRAM
英文描述: 512K X 16 STANDARD SRAM, 70 ns, PBGA48
封裝: MICRO, BGA-48
文件頁(yè)數(shù): 10/10頁(yè)
文件大?。?/td> 137K
代理商: HY62UF16804A-SM70I
HY62UF16804A
Rev.10/Jan. 2002
8
PACKAGE INFORMATION
48ball Micro Ball Grid Array Package(M)
BOTTOM VIEW
TOP VIEW
B
A
A1 CORNER
INDEX AREA
6
5
4
3
2
1
A
B
C
D
C
C1
E
3.0 X 5.0 MIN
F
FLAT AREA
G
C1/2
H
B1/2
B1
SIDE VIEW
5
E1
E2
C
E
SEATING PLANE
4
A
r
3 D(DIAMETER)
Symbol
Min.
Typ.
Max.
A
-
0.75
-
B
-
3.75
-
B1
-
7.4
-
C
-
5.25
-
C1
-
8.5
-
D
0.3
0.35
0.4
E
0.85
0.9
0.95
E1
0.6
0.65
0.7
E2
0.2
0.25
0.3
r
-
0.08
Note
1. DIMENSIONING AND TOLERANCING PER ASME Y14. 5M-1994.
2. ALL DIMENSIONS ARE MILLIMETERS.
3. DIMENSION “D” IS MEASURED AT THE MAXIMUM SOLDER
BALL DIAMETER IN A PLANE PARALLEL TO DATUM C.
4. PRIMARY DATUM C(SEATING PLANE) IS DEFINED BY THE
CROWN OF THE SOLDER BALLS.
5. THIS IS A CONTROLLING DIMENSION.
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