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參數(shù)資料
| 型號： | HX6409TBFT |
| 英文描述： | x9 Synchronous FIFO |
| 中文描述： | X9熱賣同步FIFO |
| 文件頁數(shù)： | 14/16頁 |
| 文件大?。?/td> | 156K |
| 代理商： | HX6409TBFT |
HX6409/HX6218/HX6136
14
PACKAGE DRAWING FOR 6409
(22018533-001)
The FIFO is offered in a 32-lead, 68-lead and a 132-lead flat
pack, depending on the configuration. These packages are
constructed of multilayer ceramic (Al
O
) and features
internal power and ground planes. The flat packs also
PACKAGING
feature non-conductive ceramic tie bars. The tie bars allows
electrical testing of the device, while preserving the lead
integrity during shipping and handling, up to the point of lead
forming and insertion.
[1] BSC - Basic lead spacing between centers
[2] Where lead is brazed to package
[3] Parts delivered with leads unformed
[4] Lid connected to VSS
A
b
C
D
e
E
E2
E3
F
L
Q
S
U
V
W
X
Y
Z
0.135 ± 0.015
0.017 ± 0.002
0.004 to 0.009
0.820 ± 0.008
0.050 ± 0.005 [1]
0.600 ± 0.008
0.500 ± 0.008
0.040 ref
0.750 ± 0.005 [2]
0.295 min [3]
0.026 to 0.045
0.035 ± 0.010
0.080 ref
0.380 ref
0.050 ref
0.075 ref
0.010 ref
0.135 ref
All dimensions in inches
22018533-001
E
1
e
b
D
(width)
(pitch)
F
L
TOP
VIEW
E2
A
Lead
Alloy 42
Ceramic
Body
C
E3
Cutout
Area
Q
Kovar
Lid [4]
V
Optional capacitors
in cutout
1
VSS
VDD
VDD
S
U
Z
X
W
BOTTOM
VIEW
A
A
AA
AA
A
A
AA
AA
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HX6409TBHC | x9 Synchronous FIFO |
| HX6409TBHT | x9 Synchronous FIFO |
| HX6409TBNC | x9 Synchronous FIFO |
| HX6409TBNT | x9 Synchronous FIFO |
| HX6409TBRC | x9 Synchronous FIFO |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HX6409TBHC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x9 Synchronous FIFO |
| HX6409TBHT | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x9 Synchronous FIFO |
| HX6409TBNC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x9 Synchronous FIFO |
| HX6409TBNT | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x9 Synchronous FIFO |
| HX6409TBRC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x9 Synchronous FIFO |
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