
RADIATION
Fabricated with RICMOS IV Silicon on Insulator (SOI)
0.7
μ
m Process (L
eff
= 0.55
μ
m)
Total Dose Hardness through 1x10
6
rad(SiO
2
)
Neutron Hardness through 1x10
14
cm
-2
Dynamic and Static Transient Upset Hardness
through 1x10
11
rad (Si)/s
Dose Rate Survivability through <1x10
12
rad(Si)/s
Soft Error Rate of <1x10
-10
upsets/bit-day in
Geosynchronous Orbit
No Latchup
128K x 8 STATIC RAM—SOI
HX6228
OTHER
Read/Write Cycle Times
≤
16 ns (Typical)
≤
25 ns (-55 to 125
°
C)
Typical Operating Power <25 mW/MHz
Asynchronous Operation
CMOS or TTL Compatible I/O
Single 5 V
±
10% Power Supply
Packaging Options
- 32-Lead Flat Pack (0.820 in. x 0.600 in.)
- 40-Lead Flat Pack (0.775 in. x 0.710 in.)
Military & Space Products
GENERAL DESCRIPTION
The 128K x 8 Radiation Hardened Static RAM is a high
performance 131,072 word x 8-bit static random access
memory with industry-standard functionality. It is fabricated
with Honeywell’s radiation hardened technology, and is
designed for use in systems operating in radiation environ-
ments. The RAM operates over the full military temperature
range and requires only a single 5 V
±
10% power supply. The
RAM is wire bond programmable for either TTL or CMOS
compatible I/O. Power consumption is typically less than 25
mW/MHz in operation, and less than 5 mW in the low power
disabled mode. The RAM read operation is fully asynchro-
nous, with an associated typical access time of 15 ns at 5V.
Honeywell’s enhancedSOI RICMOSIV (Radiation Insen-
sitive CMOS) technology is radiation hardened through the
use of advanced and proprietary design, layout and process
hardening techniques. The RICMOS IV process is an
advanced 5-volt, SIMOX CMOS technology with a 150
gate oxide and a minimum feature size of 0.7
μ
m (0.55
μ
m
effective gate length—L
). Additional features include
Honeywell’s proprietary SHARP planarization process, and
a lightly doped drain (LDD) structure for improved short
channel reliability. A 7 transistor (7T) memory cell is used for
superior single event upset hardening, while three layer
metal power bussing and the low collection volume SIMOX
substrate provide improved dose rate hardening.