參數(shù)資料
型號: HTMS1301FUG
廠商: NXP Semiconductors N.V.
元件分類: 通信及網絡
英文描述: ISO 18000 transponder IC
封裝: HTMS1301FTB/AF<sot1122 (XSON3)|<<http://www.nxp.com/packages/sot1122.html<1<Always Pb-free,;HTMS1301FUG/AM<Uncased die|<<<1<Always Pb-free,;HTMS8301FTB/AF<sot1122
文件頁數(shù): 3/44頁
文件大?。?/td> 719K
代理商: HTMS1301FUG
184430
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3.0 — 18 March 2010
184430
3 of 44
NXP Semiconductors
HITAG μ
ISO 18000 transponder IC
5.
Block diagram
The HITAG μ ISO 18000 transponder IC require no external power supply. The
contactless interface generates the power supply and the system clock via the resonant
circuitry by inductive coupling to the read/write device (RWD). The interface also
demodulates data transmitted from the RWD to the HITAG μ ISO 18000 transponder IC,
and modulates the magnetic field for data transmission from the HITAG μ ISO 18000
transponder IC to the RWD.
Data are stored in a non-volatile memory (EEPROM). The EEPROM has a capacity of
1760 bit and is organized in blocks.
Fig 1.
Block diagram of HITAG μ ISO 18000 transponder IC
001aai334
CLK
MOD
DEMOD
VREG
VDD
data
in
data
out
clock
R/W
ANALOGUE
RF INTERFACE
PAD
PAD
RECT
Cres
DIGITAL CONTROL
TRANSPONDER
ANTICOLLISION
READ/WRITE
CONTROL
ACCESS CONTROL
EEPROM INTERFACE
CONTROL
RF INTERFACE
CONTROL
EEPROM
SEQUENCER
CHARGE PUMP
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