Pad Assignment
HT70XX (except HT7022A)
Chip size: 1317
1158 ( m)
2
* The IC substrate should be connected to VDD in the
PCB layout artwork.
HT7022A only
Chip size: 2032
1321 ( m)
2
* The IC substrate should be connected to VDD in the
PCB layout artwork.
Absolute Maximum Ratings
SupplyVoltage,exceptHT7022A..................................................................................................V
SS
0.3VtoV
SS
+26V
SupplyVoltage,HT7022Aonly.................................................................................................................... 0.3Vto13V
Output Voltage...........................V
SS
0.3V to V
DD
+0.3V
Output Current......................................................50mA
Storage Temperature............................ 50 C to 125 C
Power Consumption..........................................200mW
Operating Temperature...............................0 C to 70 C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
HT70XX
Rev. 1.60
3
January 14, 2003
Pad Coordinates
HT70XX (except HT7022A)
Unit: m
Pad No.
X
Y
1
483.30
379.50
2
234.60
399.50
3
443.90
386.00
HT7022A only
Unit: m
Pad No.
X
Y
1
434.34
394.97
2
120.65
461.01
3
774.70
412.75