參數(shù)資料
型號: HT1622
廠商: Holtek Semiconductor Inc.
英文描述: RAM Mapping 32 x 8 LCD Controller for I/O μC(存儲器映射、用于I/O接口微機(jī)的32 x 8模式LCD控制器)
中文描述: 內(nèi)存映射32 × 8 LCD控制器的I / O微控制(存儲器映射,用于的I / O接口微機(jī)的32 × 8模式液晶顯示控制器)
文件頁數(shù): 5/17頁
文件大?。?/td> 147K
代理商: HT1622
Pad Description
Pad No.
Pad Name
I/O
Description
1
CS
I
Chip selection input with Pull-high resistor. When the CS is logic
high, the data and command read from or written to the HT1622
are disabled. The serial interface circuit is also reset. But if CS is
at logic low level and is input to the CS pad, the data and com-
mand transmission between the host controller and the HT1622
are all enabled.
2
RD
I
READ clock input with Pull-high resistor. Data in the RAM of
the HT1622 are clocked out on the rising edge of the RD signal.
The clocked out data will appear on the data line. The host con-
trollercanusethenextfallingedgetolatchtheclockedoutdata.
3
WR
I
WRITE clock input with Pull-high resistor. Data on the DATA
line are latched into the HT1622 on the rising edge of the WR sig-
nal.
4
DATA
I/O
Serial data input/output with Pull-high resistor
5
VSS
Negative power supply, ground
6
OSCI
I
If the system clock comes from an external clock source, the ex-
ternal clock source should be connected to the OSCI pad.
7
VDD
Positive power supply
8
VLCD
I
LCD operating voltage input pad
9
IRQ
O
Time base or Watchdog Timer overflow flag, NMOS open drain
output
10, 11
BZ, BZ
O
2kHz or 4kHz tone frequency output pair
12~14
T1~T3
I
Not connected
15~22
COM0~COM7
O
LCD common outputs
23~54
SEG0~SEG31
O
LCD segment outputs
Absolute Maximum Ratings
Supply Voltage.............................. 0.3V to 5.5V
Storage Temperature................. 50 C to 125 C
Input Voltage................V
SS
0.3V to V
DD
+0.3V
Operating Temperature .............. 25 C to 75 C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maxi-
mumRatings maycausesubstantialdamagetothedevice.Functionaloperationofthisdevice
at other conditions beyond those listed in the specification is not implied and prolonged expo-
sure to extreme conditions may affect device reliability.
HT1622
5
January 10, 2001
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