
Pad Assignment
Pad Coordinates
Unit: m
Pad No.
X
Y
1
610.00
701.90
2
622.00
461.60
3
622.00
350.60
4
622.00
239.70
5
616.00
695.20
6
502.00
695.20
7
388.50
687.70
8
87.95
647.80
9
575.80
172.40
10
575.80
444.20
11
308.30
660.40
12
22.10
635.90
13
-122.40
638.40
14
-270.40
701.90
15
384.50
701.90
16
495.50
701.90
Chip Size: 1530
1690 m
* The IC substrate should be connected to VSS in the PCB layout artwork.
Pin Description
Pin No.
Pin Name
I/O
Internal Connection
Description
1~8
A0~A7
I
NMOS
Open Drain
Address pin.
9
VSS
Negative power supply, ground
10
AUD
O
PMOS
Open Drain
Audio out
11
DIN
I
COMS In
Serial data input
12
AMP
O
CMOS
Amp feed back
13
OSCI
I
Oscillator input pin.
14
VT
O
CMOS
Busy, data valid
15
TEST
I
CMOS In
Test pin.
16
VDD
Positive power supply
Absolute Maximum Ratings
Supply Voltage ........................................ 0.3V to 5.5V
Storage Temperature ........................... 50 C to 125 C
Input Voltage .............................V
SS
0
.
3V to V
DD
+0.3V
Operating Temperature .......................... 25 C to 70 C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
HT12M
Rev. 1.00
2
March 25, 2002
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