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參數(shù)資料
| 型號(hào)： | HSMx-C260 |
| 英文描述： | Surface Mount Chip LEDs(表貼型芯片LED) |
| 中文描述： | 表面貼裝芯片發(fā)光二極管（表貼型芯片發(fā)光二極管） |
| 文件頁(yè)數(shù)： | 4/7頁(yè) |
| 文件大?。?/td> | 192K |
| 代理商： | HSMX-C260 |
4
Figure 2. Forward Current vs. Forward Voltage.
Figure 3. Luminous Intensity vs. Forward Current.
Figure 4. Maximum Forward Current vs.
Ambient Temperature.
Figure 5. Relative Intensity vs. Angle.
Figure 6. Recommended Reflow Soldering Profile.
Figure 7. Recommended Solder Pad Pattern.
Note:
1. All dimensions in millimeters (inches).
R
1.00
0
-90
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70
-50
-30
0
20 30
50
70
90
-20
-80
-60
-40
-10
10
40
60
80
1.25 (0.049)
1.4
(0.055)
2.3
(0.091)
1.4
(0.055)
2.2 (0.087) DIA. PCB HOLE
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
T
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
0
10
20
40
I
F
– FORWARD CURRENT – mA
0
0.4
1.2
1.6
L
(
30
0.8
100
10
1
0.11.5
1.7
1.9
2.1
2.3
V
F
– FORWARD VOLTAGE – V
I
F
GREEN
HER
ORANGE
YELLOW
0
35
0
20
60
80
100
5
I
F
T
A
– AMBIENT TEMPERATURE – °C
40
15
25
30
10
R
θ
J-A
= 600°C/W
20
R
θ
J-A
= 800°C/W
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| HSMX-C265 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:Surface Mount Chip LEDs |
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| HSMX-C660 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:Right Angle Surface Mount Chip LEDs |
| HSMX-C670 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Surface Mount Chip LEDs |
| HSMX-H670 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Surface Mount Flip Chip LEDs |
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