參數(shù)資料
型號: HSMS-820X
英文描述: Surface Mount Schottky Diodes -- Reliability Data (27K in pdf)
中文描述: 表面貼裝肖特基二極管-可靠性數(shù)據(jù)(27K PDF格式)
文件頁數(shù): 7/8頁
文件大?。?/td> 230K
代理商: HSMS-820X
7
Figure 10. Tape dimensions.
Figure 11. Tape leader and trailer dimensions.
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060,
Surface
Mounting SMT LED Indicator
Components.
Storage Condition: 5 to 30 C @ 60% RH max.
Baking is required under the condition:
a) the blue silica gel indicator becoming white/transparent color
b) the pack has been opened for more than 1 week
Baking recommended condition: 60 +/– 5C for 20 hours.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
± 0.10 (0.004)
PART NUMBER
CATHODE
DIM. B
± 0.10 (0.004)
DIM. C
± 0.10 (0.004)
HSMx-C191 SERIES 1.80 (0.071) 0.95 (0.037) 0.75 (0.030)
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
END
START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
相關PDF資料
PDF描述
HSMS-C191 Agilent HSMS-C191 Low Profile ChipLED
HSMF-C157 Surface Mount Chip LEDs(表貼型LED芯片)
HSMF-C155 Surface Mount Chip LEDs(表貼型LED芯片)
HSMF-C156 Surface Mount Chip LEDs(表貼型LED芯片)
HSMF-C656 Bicolor Surface Mount Chip LEDs(雙色表貼型LED芯片)
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