參數(shù)資料
型號: HSMS-28XXSERIES
英文描述: Surface Mount RF Schottky Barrier Diodes (222K in pdf)
中文描述: 表面貼裝射頻肖特基二極管(222K PDF格式)
文件頁數(shù): 7/8頁
文件大?。?/td> 230K
代理商: HSMS-28XXSERIES
7
Figure 10. Tape dimensions.
Figure 11. Tape leader and trailer dimensions.
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060,
Surface
Mounting SMT LED Indicator
Components.
Storage Condition: 5 to 30 C @ 60% RH max.
Baking is required under the condition:
a) the blue silica gel indicator becoming white/transparent color
b) the pack has been opened for more than 1 week
Baking recommended condition: 60 +/– 5C for 20 hours.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
± 0.10 (0.004)
PART NUMBER
CATHODE
DIM. B
± 0.10 (0.004)
DIM. C
± 0.10 (0.004)
HSMx-C191 SERIES 1.80 (0.071) 0.95 (0.037) 0.75 (0.030)
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
END
START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
相關(guān)PDF資料
PDF描述
HSMS-8002 Schottky Barrier Chips for Hybrid Integrated Circuits (43K in pdf)
HSMS-8012 Schottky Barrier Chips for Hybrid Integrated Circuits (43K in pdf)
HSMS-8101 Surface Mount Schottky Diodes -- Reliability Data (27K in pdf)
HSMS-8101SINGLE Surface Mount Microwave Schottky Mixer Diodes (69K in pdf)
HSMS-8202 X-band mixer diode
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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