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參數(shù)資料
| 型號(hào)： | HSMS-280X |
| 英文描述： | Surface Mount RF Schottky Barrier Diodes |
| 中文描述： | 表面貼裝射頻肖特基二極管 |
| 文件頁(yè)數(shù)： | 6/10頁(yè) |
| 文件大?。?/td> | 146K |
| 代理商： | HSMS-280X |
6
TIME (seconds)
T
MAX
T
°
C
0
0
50
100
150
200
250
60
Preheat
Zone
Cool Down
Zone
Reflow
Zone
120
180
240
300
Figure 8. Surface Mount Assembly Profile.
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
package, will reach solder reflow
temperatures faster than those
with a greater mass.
Agilent
’
s SOT diodes have been
qualified to the time-temperature
profile shown in Figure 8. This
profile is representative of an IR
reflow type of surface mount
assembly process.
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera-
tures and times necessary to
achieve a uniform reflow of
solder.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
MAX
) should not
exceed 235
°
C.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HSMS-2827-TR1G | Surface Mount RF Schottky Barrier Diodes |
| HSMS-2820-BLKG | Surface Mount RF Schottky Barrier Diodes |
| HSMS-2820-TR1G | Surface Mount RF Schottky Barrier Diodes |
| HSMS-2820-TR2G | Surface Mount RF Schottky Barrier Diodes |
| HSMS-2822-BLKG | Surface Mount RF Schottky Barrier Diodes |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSMS-280X/1X/2X | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Surface Mount Schottky Diodes -- Reliability Data (28K in pdf) |
| HSMS-280x-BLKG | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:Surface Mount RF Schottky Barrier Diodes Single, Dual and Quad Versions |
| HSMS-280X-TR1G | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:Surface Mount RF Schottky Barrier Diodes |
| HSMS-280X-TR2G | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:Surface Mount RF Schottky Barrier Diodes |
| HSMS-2810 | 制造商:Avago Technologies 功能描述:DIODE SCHOTTKY RF SOT23 |
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