參數(shù)資料
型號: HSMR-C1xx
英文描述: Agilent HSMx-C1xx High Performance Chip LED
中文描述: 安捷倫HSMx - C1xx高性能的芯片發(fā)光二極管
文件頁數(shù): 9/12頁
文件大?。?/td> 235K
代理商: HSMR-C1XX
9
Figure 12. Recommended Pb-free reflow soldering profile.
Figure 13. Recommended soldering pattern for HSMx-C110.
Figure 14. Recommended soldering pattern for HSMx-C170/177.
5.0 (0.200)
1.0 (0.039)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING
BOARD
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
Figure 16. Recommended soldering pattern for HSMx-C150.
1.5 (0.059)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
Figure 15. Recommended soldering pattern
for HSMx-C130/190/191/197.
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 17. Recommended soldering pattern for HSMx-C120.
Figure 18. Recommended soldering pattern for HSMx-C265.
0.7 (0.028)
0.8
(0.031)
0.8
(0.031)
1.2
(0.047)
0.4 (0.016)
0.15 (0.006)
0.4 (0.016)
CENTERING
BOARD
1.25 (0.049)
1.4
(0.055)
2.3
(0.091)
1.4
(0.055)
2.2 (0.087) DIA. PCB HOLE
217 °C
MAX. 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
100 - 150 °C
255 °C (+5/-0)
60 to 150 SEC.
10 to 20 SEC.
TIME
T
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 11. Recommended reflow soldering profile.
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
T
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
相關(guān)PDF資料
PDF描述
HSMQ-170 Agilent HSMx-C1xx High Performance Chip LED
HSMQ-190 Agilent HSMx-C1xx High Performance Chip LED
HSMQ-191 Agilent HSMx-C1xx High Performance Chip LED
HSMQ-197 Agilent HSMx-C1xx High Performance Chip LED
HSMR-170 Agilent HSMx-C1xx High Performance Chip LED
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