參數(shù)資料
型號(hào): HSMC-C150
廠商: Avago Technologies Ltd.
英文描述: High Performance ChipLED
中文描述: 高性能采用的ChipLED
文件頁數(shù): 10/11頁
文件大?。?/td> 431K
代理商: HSMC-C150
Figure 15. Tape dimensions.
Figure 16. Tape leader and trailer dimensions.
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060,
Surface
Mounting SMT LED Indicator
Components.
Storage Condition: 5 to 30C
@ 60% RH max.
Baking is required under the
condition:
a) Humidity Indicator Card is
> 10% when read at 23
±
5
°
C.
b) Device exposed to factory
conditions < 30
°
C/60% RH
more than 672 hours.
Baking recommended condition:
60 + /– 5C for 20 hours.
END
START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
10
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
± 0.10 (± 0.004)
PART NUMBER
CATHODE
DIM. B
± 0.10 (± 0.004)
DIM. C
± 0.10 (± 0.004)
HSMx-C170 SERIES 2.30 (0.091) 1.45 (0.057) 0.95 (0.037)
HSMx-C110 SERIES 3.40 (0.134) 1.70 (0.067) 1.20 (0.047)
HSMx-C150 SERIES 3.50 (0.138) 1.88 (0.074) 1.27 (0.050)
HSMx-C190 SERIES 1.75 (0.069) 0.90 (0.035) 0.90 (0.035)
HSMx-C191 SERIES 1.86 (0.073) 0.89 (0.035) 0.87 (0.034)
HSMx-C110
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)
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