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參數(shù)資料
| 型號(hào)： | HSEC8-120-01-S-D-EM2 |
| 廠(chǎng)商： | SAMTEC INC |
| 元件分類(lèi)： | 邊緣插接連接器 |
| 英文描述： | 40 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SURFACE MOUNT, SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大小： | 630K |
| 代理商： | HSEC8-120-01-S-D-EM2 |
(0,80mm) .0315"
HSEC8-EM, DEC8 SERIES
WWW.SAMTEC.COM
DEC8–140–01–S
HSEC8–130–01–S–D–EM2
F-210
For complete specications and
recommended PCB layouts see
www.samtec.com?HSEC8-EM
Insulator Material:
Liquid Crystal Polymer
Contact: BeCu
Plating: Au or Sn over
50" (1,27m) Ni
Current Rating:
3.1A @ 30°C Temperature Rise
(See website for details)
Operating Temp:
-55°C to +125°C
Card Insertion Depth:
(3,15mm) .125" nominal
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable: Yes
RoHS Compliant: Yes
Note: Some lengths, styles
and options are non-standard,
non-returnable.
EM2
HSEC8
10, 20, 30, 40, 50, 60
PLATING
OPTION
D
No. of Positions x (0,80) .0315 + (4,60) .181
01
02
(0,80) .0315
No. of Positions x (0,80) .0315 + (15,20) .598
(5,60)
.220
(1,75)
.069
(7,00)
.276
(5,00)
.197
(7,80)
.307
A
B
No. of Positions x (0,80) .0315 + (18,40) .724
No. of Positions x (0,80) .0315 + (7,80) .307
01
1
POSITIONS
PER ROW
40
50
60
A
(18,90)
.744
(22,90)
.902
(26,90)
1.059
B
(36,60)
1.441
(44,60)
1.756
(52,60)
2.071
–EM2
= (1,60mm)
.062" thick
PCB
POSITIONS
PER ROW
–S
= 30" (0,76m)
Gold on contact,
Matte Tin on tail
ALSO AVAILABLE
CONNECTOR
CABLE
EEDP–08
EEDP–16
EEDP–24
EEDP–32
HSEC8–113
HSEC8–125
HSEC8–137
HSEC8–149
Polarized mates for EEDP
Series twinax cables
Mates with:
(1,60mm) 0.62" thick
cards, EEDP, HSC8
DEC8
PLATING
–S
= 30" (0,76m)
Gold on contact
LEAD
STYLE
40, 50, 60
–01
= (1,60) .062"
Card Thickness
1
POSITIONS
PER ROW
Mates with:
(1,60mm) .062"
thick cards, HSC8
APPLICATIONS
(47,75)
1.880
(55,75)
2.195
(63,75)
2.510
POSITIONS
PER ROW
40
50
60
A
(36,60)
1.441
(44,60)
1.756
(52,60)
2.071
B
(18,90)
.744
(22,91)
.902
(26,90)
1.059
C
(9,83)
.387
A
B
C
(4,00) .157
02
01
(17,58)
.692
(4,99)
.197
Moulding removed
for clarity
EEDP
Series
APPLICATIONS
–EM to –DV
–EM to EEDP–DV
Note: Requires PCB
thickness of (1,60mm)
.062" ±(0,08mm) .003"
For complete specications and
recommended PCB layouts see
www.samtec.com?DEC8
Insulator Material:
Black ABS
Contact: BeCu
Plating:
Au or Sn over 50" (1,27m) Ni
Current Rating:
3.1A @ 95°C relative to 125°C
(See website for details)
Operating Temp:
-55°C to +125°C
RoHS Compliant: Yes
SPECIFICATIONS
Note: Other Gold plating
options available.
Contact Samtec.
EDGE MOUNT EDGE RATE CARD SOCKET
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HSEC8-130-01-S-D-EM2 | 60 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SURFACE MOUNT, SOCKET |
| HSEC8-140-01-S-D-EM2 | 80 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SURFACE MOUNT, SOCKET |
| HSEC8-150-01-S-D-EM2 | 100 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SURFACE MOUNT, SOCKET |
| HSEC8-160-01-S-D-EM2 | 120 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SURFACE MOUNT, SOCKET |
| HSEC8-150-01-S-DV-A-K | 100 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SURFACE MOUNT, SOCKET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSEC8-120-01-S-DV-A | 制造商:Samtec Inc 功能描述:CONN CARD EDGE SKT 40 POS 0.8MM SLDR ST SMD - Bulk |
| HSEC8-120-01-S-DV-A-BL | 制造商:Samtec Inc 功能描述:.8MM HIGH SPEED DUAL VERTICAL MOUNT EDGE CARD ASSEMBLY - Bulk |
| HSEC8-120-01-S-DV-A-BL-K | 制造商:Samtec Inc 功能描述:.8MM HIGH SPEED DUAL VERTICAL MOUNT EDGE CARD ASSEMBLY - Bulk |
| HSEC8-120-01-S-DV-A-BL-K-TR | 制造商:Samtec Inc 功能描述:.8MM HIGH SPEED DUAL VERTICAL MOUNT EDGE CARD ASSEMBLY - Tape and Reel |
| HSEC8-120-01-S-DV-A-BL-TR | 制造商:Samtec Inc 功能描述:.8MM HIGH SPEED DUAL VERTICAL MOUNT EDGE CARD ASSEMBLY - Tape and Reel |
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