參數(shù)資料
型號(hào)： HSDL-3602-008
廠商： Avago Technologies Ltd.
英文描述： IrDA㈢ Data 1.4 Compliant 4 Mb/s 3V Infrared Transceiver
中文描述： ㈢數(shù)據(jù)的IrDA 1.4兼容4 Mb / s的3V的紅外收發(fā)器
文件頁數(shù)： 16/27頁
文件大?。?/td> 388K
代理商： HSDL-3602-008
16
Figure 4. Solder paste stencil aperture.
See Figure 4
w, the width of aperture is fixed at 0.70 mm (0.028 inches)
Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimension.
t, nominal stencil thickness
mm
0.152
0.127
l, length of aperture
mm
2.8 ± 0.05
3.4 ± 0.05
inches
0.006
0.005
inches
0.110 ± 0.002
0.134 ± 0.002
2.0. Recommended solder paste/cream volume for castel-
lation joints
Based on calculation and experiment, the printed sol-
der paste volume required per castellation pad is 0.30
cubic mm (based on either no-clean or aqueous solder
cream types with typically 60 to 65% solid content by
volume).
2.1. Recommended Metal Solder Stencil Aperture
It is recommended that only 0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick stencil be used for solder
paste printing. This is to ensure adequate printed solder
paste volume and no shorting. The following combina-
tion of metal stencil aperture and metal stencil thick-
ness should be used:
3.0. Pick and Place Misalignment Tolerance and Product
Self-Alignment after Solder Reflow
If the printed solder paste volume is adequate, the
unit will self-align in the X-direction after solder reflow.
Units should be properly reflowed in IR Hot Air convec-
tion oven using the recommended reflow profile. The
direction of board travel does not matter.
Allowable Misalignment Tolerance
X-direction
Theta-direction
≤ 0.2 mm (0.008 inches)
± 2 degrees
HSDL-3602 fig 4.0
APERTURE AS PER
LAND
SOLDER
PASTE
l
w
t (STENCIL THICKNESS)
相關(guān)PDF資料
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HSDL-3603-007 制造商:Avago Technologies 功能描述:TRANSCEIVER SMD IRDA1.4 4MB
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