參數(shù)資料
型號(hào)： HSDL-3201
英文描述： Low Power Compliant 115.2 kb/s Infrared Transceiver(115.2 kb/s紅外順應(yīng)收發(fā)器)
中文描述： 低功耗符合115.2 kb / s的紅外收發(fā)器（115.2 kb / s的紅外順應(yīng)收發(fā)器）
文件頁(yè)數(shù)： 13/16頁(yè)
文件大小： 237K
代理商： HSDL-3201
13
Reflow Profile
Process Zone
Heat Up
Solder Paste Dry
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
T
Maximum
T/
time
4
°
C/s
0.5
°
C/s
4
°
C/s
-4
°
C/s
-3
°
C/s
25
°
C to 125
°
C
125
°
C to 170
°
C
170
°
C to 230
°
C (245
°
C max.)
230
°
C to 170
°
C
170
°
C to 25
°
C
Solder Reflow
Cool Down
The reflow profile is a straight
line representation of a nominal
temperature profile for a
convective reflow solder process.
The temperature profile is divided
into four process zones, each
with different
T/
time
temperature change rates. The
T/
time rates are detailed in the
above table. The temperatures
are measured at the component
to printed circuit board
connections.
In
process zone P1
, the PC
board and HSDL-3201
castellation pins are heated to a
temperature of 125
°
C to activate
the flux in the solder paste. The
temperature ramp up rate, R1, is
limited to 4
°
C per second to allow
for even heating of both the PC
board and HSDL-3201
castellations.
Process zone P2
should be of
sufficient time duration (greater
than 60 seconds), to dry the
solder paste. The temperature is
raised to a level just below the
liquidus point of the solder,
usually 170
°
C (338
°
F).
Process zone P3
is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 230
°
C (446
°
F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 15 and 90 seconds. It
usually takes about 15 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell time
of 90 seconds, the intermetallic
growth within the solder
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 170
°
C (338
°
F), to allow
the solder within the connections
to freeze solid.
Process zone P4
is the cool
down after solder freeze. The
cool down rate, R5, from the
liquidus point of the solder to
25
°
C (77
°
F) should not exceed
3
°
C per second maximum. This
limitation is necessary to allow
the PC board and HSDL-3201
castellations to change
dimensions evenly, putting
minimal stresses on the
HSDL-3201 transceiver.
0
t-TIME (SECONDS)
P2
SOLDER PASTE DRY
T
200
183
170
150
125
100
50
50
150
100
200
250
300
230
P1
HEAT
UP
P3
SOLDER
REFLOW
P4
COOL
DOWN
25
R1
R2
R3
R4
R5
90 sec.
MAX.
ABOVE
183°C
MAX. 245°C
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PDF描述
HSDL-4230 High-Performance T-1 3 /4 (5 mm) TS AlGaAs Infrared (875 nm) Lamp(高性能T-1 3 /4 (5 mm)透明物質(zhì)鋁砷化鎵紅外線(xiàn)(875 nm)照明燈)
HSDL-4400 High-Performance IR Emitter Photodiode in Subminiature SMT Package(高性能 IR發(fā)射器光二極管（微型SMT封裝）)
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HSDL-4420 High-Performance IR Emitter Photodiode in Subminiature SMT Package(高性能 IR發(fā)射器光二極管（微型SMT封裝）)
HSDL-5420 High-Performance IR PIN Photodiode in Subminiature SMT Package(高性能 IR PIN 光二極管（微型SMT封裝）)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HSDL-3201#001 功能描述:紅外收發(fā)器 IR Transceiver 115.2Kb/s RoHS:否 制造商:Vishay Semiconductors 波長(zhǎng):900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強(qiáng)度:60 mW/sr 半強(qiáng)度角度:44 deg 脈沖寬度:2 us 最大上升時(shí)間:100 ns 最大下降時(shí)間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel
HSDL-3201#008 功能描述:紅外收發(fā)器 IR Transceiver 115.2Kb/s RoHS:否 制造商:Vishay Semiconductors 波長(zhǎng):900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強(qiáng)度:60 mW/sr 半強(qiáng)度角度:44 deg 脈沖寬度:2 us 最大上升時(shí)間:100 ns 最大下降時(shí)間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel
HSDL-3201#011 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:FIBER OPTIC TRANSCEIVER
HSDL-3201#018 制造商:LITEON 功能描述:IrDA Data 1.4 Compliant 4 Mb/s 3V Infrared Transceiver
HSDL-3201#021 功能描述:紅外收發(fā)器 IR Transceiver 115.2Kb/s RoHS:否 制造商:Vishay Semiconductors 波長(zhǎng):900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強(qiáng)度:60 mW/sr 半強(qiáng)度角度:44 deg 脈沖寬度:2 us 最大上升時(shí)間:100 ns 最大下降時(shí)間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel
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