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參數(shù)資料
| 型號： | HSDL-3005-021 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | IrDA㈢ Data Compliant Low Power 115.2 kbit/s with Remote Control Infrared Transceiver |
| 中文描述： | 紅外線㈢數(shù)據(jù)兼容低功耗115.2 kbit / s的紅外遙控器 |
| 文件頁數(shù)： | 13/22頁 |
| 文件大?。?/td> | 548K |
| 代理商： | HSDL-3005-021 |
13
Recommended Reflow Profile
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
D
T
25
°
C to 160
°
C
160
°
C to 200
°
C
200
°
C to 255
°
C (260
°
C at 10 seconds max.)
255
°
C to 200
°
C
200
°
C to 25
°
C
Maximum
D
T/
D
time
4
°
C/s
0.5
°
C/s
4
°
C/s
–6
°
C/s
–6
°
C/s
Cool Down
The reflow profile is a straight-
line representation of a nominal
temperature profile for a con-
vective reflow solder process.
The temperature profile is
divided into four process zones,
each with different
D
T/
D
time
temperature change rates. The
D
T/
D
time rates are detailed in
the above table. The tempera–
tures are measured at the
component to printed circuit
board connections.
In
process zone P1
, the PC
board and HSDL-3005
castellation pins are heated to a
temperature of 160
°
C to activate
the flux in the solder paste. The
temperature ramp up rate, R1, is
limited to 4
°
C per second to
allow for even heating of both
the PC board and HSDL-3005
castellations.
Process zone P2
should be of
sufficient time duration (60 to
120 seconds) to dry the solder
paste. The temperature is raised
to a level just below the liquidus
point of the solder, usually
200
°
C (392
°
F).
Process zone P3
is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of
solder to 255
°
C (491
°
F) for
optimum results. The dwell time
above the liquidus point of
solder should be between 20 and
60 seconds. It usually takes
about 20 seconds to assure
proper coalescing of the solder
balls into liquid solder and the
formation of good solder
connections. Beyond a dwell
time of 60 seconds, the
intermetallic growth within the
solder connections becomes
excessive, resulting in the
formation of weak and
unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the
solder, usually 200
°
C (392
°
F), to
allow the solder within the
connections to freeze solid.
Process zone P4
is the cool
down after solder freeze. The
cool down rate, R5, from the
liquidus point of the solder to
25
°
C (77
°
F) should not exceed
6
°
C per second maximum. This
limitation is necessary to allow
the PC board and HSDL-3005
castellations to change
dimensions evenly, putting
minimal stresses on the HSDL-
3005 transceiver.
0
t-TIME (SECONDS)
T
–
–
°
C
230
220
200
180
160
120
80
50
150
100
200
250
300
255
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL
DOWN
25
R1
R2
R3
R4
R5
60 sec.
MAX.
ABOVE
220
°
C
MAX. 260
°
C
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSDL-3005-028 | 功能描述:紅外收發(fā)器 20cm 3V SIR plus R C Top View RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強(qiáng)度:60 mW/sr 半強(qiáng)度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3020 | 制造商:Avago Technologies 功能描述:TRANSCEIVER IRDA 4MB/S |
| HSDL-3020-021 | 功能描述:紅外收發(fā)器 Orion 2 FIR + RC RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強(qiáng)度:60 mW/sr 半強(qiáng)度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3021 | 制造商:Avago Technologies 功能描述:TRANSCEIVER IRDA 4MB/S |
| HSDL-3021-021 | 功能描述:紅外收發(fā)器 FIR + RC RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強(qiáng)度:60 mW/sr 半強(qiáng)度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
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