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參數(shù)資料
| 型號： | HSDL-3003-001 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | IrDA㈢ Data Compliant Low Power 115.2 kbit/s with Remote Control Infrared Transceiver |
| 中文描述： | 紅外線㈢數(shù)據(jù)兼容低功耗115.2 kbit / s的紅外遙控器 |
| 文件頁數(shù)： | 15/21頁 |
| 文件大?。?/td> | 458K |
| 代理商： | HSDL-3003-001 |
15
Appendix B:
PCB Layout Suggestion
The following PCB layout
guidelines should be followed to
obtain a good PSRR and EM
immunity resulting in good
electrical performance. Things to
note:
1. The ground plane should be
continuous under the part, but
should not extend under the
shield trace.
2. The shield trace is a wide, low
inductance trace back to the
system ground. CX1, CX2 and
CX3 are optional supply filter
capacitors; they may be left out
if a clean power supply is used.
3. VLED can be connected to
either unfiltered or unregulated
power supply. If VLED and Vcc
share the same power supply,
CX3 need not be used and the
connections for CX1 and CX2
should be before the current
limiting resistor R1. In a noisy
environment, including
capacitor CX2 can enhance
supply rejection. CX1 is
generally a ceramic capacitor
of low inductance providing a
wide frequency response while
CX2 and CX3 are tantalum
capacitors of big volume and
fast frequency response. The
use of a tantalum capacitor is
more critical on the VLED line,
which carries a high current.
4. Preferably a multi-layered
board should be used to
provide sufficient ground
plane. Use the layer
underneath and near the
transceiver module as Vcc, and
sandwich that layer between
ground connected board
layers. Refer to the diagram
below for an example of a
four-layer board.
The area underneath the module
at the second layer, and 3 cm in
all directions around the module,
is defined as the critical ground
plane zone. The ground plane
should be maximized in this zone.
Top View
Refer to application note AN1114
or the Avago IrDA Data Link
Design Guide for details. The
layout below is based on a
two-layer PCB.
Bottom View
TOP LAYER
CONNECT THE METAL SHIELD AND MODULE
GROUND PIN TO BOTTOM GROUND LAYER.
LAYER 2
CRITICAL GROUND PLANE ZONE. DO NOT
CONNECT DIRECTLY TO THE MODULE
GROUND PIN.
LAYER 3
KEEP DATA BUS AWAY FROM CRITICAL
GROUND PLANE ZONE.
BOTTOM LAYER (GND)
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| HSDL-3003-021 | 功能描述:紅外收發(fā)器 20 CM 3V SIR PLUS RC RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3003-021 | 制造商:Avago Technologies 功能描述:TRANSCEIVER SMD IRDA 115.2KB |
| HSDL-3003-028 | 功能描述:紅外收發(fā)器 20 cm 3V SIR plus RC Top Option RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3005 | 制造商:Avago Technologies 功能描述:TRANSCEIVER IRDA 115.2KB/S |
| HSDL-3005-021 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:IrDA㈢ Data Compliant Low Power 115.2 kbit/s with Remote Control Infrared Transceiver |
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