參數(shù)資料
型號: HSDL-3002
廠商: Avago Technologies Ltd.
英文描述: IrDA㈢ Data Compliant Low Power 115.2 kbit/s with Remote Control Transmission Infrared Transceiver
中文描述: 紅外線㈢數(shù)據(jù)兼容低功耗115.2 kbit / s的傳輸與紅外遙控收發(fā)器
文件頁數(shù): 4/20頁
文件大?。?/td> 451K
代理商: HSDL-3002
4
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is
50
°
C/W.
Parameter
Storage Temperature
Operating Temperature
LED Supply Voltage
Supply Voltage
Output Voltage: RXD
LED Current Pulse Amplitude
Symbol
T
S
T
A
V
LED
V
CC
V
O
ILED
Min.
–40
–20
0
0
–0.5
Max.
100
70
7
7
7
500
Units
°
C
°
C
V
V
V
mA
Conditions
90
μ
s Pulse Width
20% duty cycle
Recommended Operating Conditions
Parameter
Operating Temperature
Supply Voltage
Logic Input Voltage for TXD Logic High
Symbol
T
A
V
CC
V
IH
V
IL
EI
H
EI
L
t
TPW
(SIR) 1.5
Min.
–20
2.7
2/3 V
CC
0
0.0081
Max.
70
5.5
V
CC
1/3 V
CC
V
500
0.3
1.6
115.2
Units
°
C
V
V
Conditions
Logic Low
Logic High
Logic Low
Receiver Input Irradiance
mW/cm
2
For in-band signals
115.2 kbps
[7]
mW/cm
2
For in-band signals
[7]
μ
s
t
PW
(TXD) = 1.6
μ
s at 115.2 kbps
kbps
TXD Pulse Width (SIR)
Receiver Data Rate
9.6
Transceiver I/O Truth Table
Inputs
Outputs
Transceiver Mode
Shutdown IrDA (TXD) Remote Control Input
EI
IR LED
RC LED
RXD
Active
0
0
0
High
[4]
Off
Off
Low
[5]
Active
0
0
0
Low
Off
Off
High
Active
0
0
1
X
Off
On
Not Valid
Active
0
1
0
X
On
Off
Not Valid
Active
0
1
1
X
On
On
Not Valid
Shutdown
1
X
[6]
X
[6]
Low
Not Valid
Not Valid
Not Valid
X = Don’t Care
EI = In-Band Infrared Intensity at detector
Notes:
4. In-Band EI
115.2 kb/s.
5. Logic Low is a pulsed response. The condition is maintained for duration dependent on the pattern and strength of the incident intensity.
6. To maintain low shutdown current, TXD need to be driven high or low and not left floating. The Remote Control Input should be tied low.
CAUTION:
The BiCMOS inherent to this design of this component increases the component’s susceptibility to
damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and
assembly of this component to prevent damage and/or degradation, which may be induced by ESD.
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