參數(shù)資料
型號(hào)： HS1-80C86RH
廠商： Intersil Corporation
英文描述： Radiation Hardened 16-Bit CMOS Microprocessor
中文描述： 輻射加固16位CMOS微處理器
文件頁(yè)數(shù)： 28/37頁(yè)
文件大?。?/td> 239K
代理商： HS1-80C86RH
883
Spec Number
518055
HS-80C86RH
Intersil Space Level Product Flow - Q
All Lots - Wafer Lot Acceptance (Including SEM)
Method 5007
Each Wafer - GAMMA Radiation Verification,
Two samples/wafer, 0 rejects, Method 1019
100% Nondestructive Bond Pull, Method 2023
Sample - Wire Bond Pull Monitor, Method 2011
Sample - Die Shear Monitor, Method 2019 or 2027
100% Internal Visual Inspection, Method 2010, Condition A
100% Temperature Cycle - Method 1010, Condition C,
10 cycles
100% Constant Acceleration, Method 2001, Condition
Per Method 5004
100% PIND - Method 2020, Condition A
100% External Visual
100% Serialization
100% Initial Electrical Test (T0)
100% Static Burn-In 1, Method 1015, Condition A or B,
72 Hours Minimum, 125
o
C minimum
NOTES:
1. Modified SEM Inspection, not compliant to MIL-STD-883, Method 2018. This device does not meet the Class S minimum metal step cov-
erage of 50%. The metal does meet the current density requirement of <2 E
5
A/cm
2
. Data provided upon request.
100% Interim Electrical Test 1 (T1)
100% Delta Calculation (T0-T1)
100% PDA 1, Method 5004 (Note 1)
100% Dynamic Burn-In, Condition D, 240 hours, +125
o
C or
Equivalent Per Method 1015
100% Interim Electrical Test 2 (T2)
100% Delta Calculation (T0-T2)
100% PDA 2, Method 5004 (Note 2)
100% Final Electric Test (T3)
100% Fine/Gross Leak, Method 1014
100% Radiographic, Method 2012 (Note 3)
100% External Visual, Method 2009
Sample - Group A, Method 5005 (Note 4)
Sample - Group B, Method 5005 (Note 5)
Sample - Group D, Method 5005 (Notes 5, 6)
100% Data Package Generation (Note 6)
2. Failures from subgroups 1, 7 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the
failures from subgroup 7.
3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004.
4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.
5. Group B and D inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include
separate line items for Group B test, Group B samples, Group D tests and Group D samples.
6. Group D Generic Data, as defined by MIL-I-38535, is optional and will not be supplied unless required by the P.O. When required, the
P.O. should include separate line items for Group D generic data. Generic Data is not guaranteed to be available and is therefore not
available in all cases.
7. Data Package Contents:
Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quan-
tity). Wafer Lot Acceptance Report (Method 5007) to include reproductions of SEM photos with percent of step coverage.
GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, test package used, specification numbers, test
equipment, etc. Radiation Read and Record data on file at Intersil.
X-Ray Report and Film, including penetrameter measurements.
Lot Serial Number Sheet (Good Unit(s) Serial Number and Lot Number).
Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test.
Group B and D attributes and/or Generic data is included when required by P.O.
The Certificate of Conformance is a part of the shipping invoice and is not part of Data Book. The Certificate of Conformance
is signed by an authorized Quality Representative.
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