
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HSL200102
Issued Date : 2001.11.01
Revised Date : 2001.11.22
Page No. : 12/12
HMSZ52XXB Series
HSMC Product Specification
SOD-323 Dimension
*: Typical
Inches
Millimeters
Min.
1.60
1.15
0.80
0.25
Inches
Millimeters
Min.
0.15
0.00
0.089
2.30
DIM
Min.
0.0630
0.0453
0.0315
0.0098
Max.
0.0709
0.0531
0.0394
0.0157
Max.
1.80
1.35
1.00
0.40
DIM
Min.
0.0060
0.0000
0.0035
0.0906
Max.
-
0.0040
0.0070
0.1063
Max.
-
0.10
0.177
2.70
A
B
C
D
E
H
J
K
Notes:
1.Dimension and tolerance based on our Spec. dated DEC. 20, 2000.
2.Controlling dimension : millimeters.
3.Lead thickness specified per L/F drawing with solder plating.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy ; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
D
A
H
J
K
C
E
B
1
2
Style: Pin 1.Cathode 2.Anode
2-Lead SOD-323 Plastic Surface Mounted Package, HSMC Package Code: SL
Marking:
X X