參數資料
型號： HMPS-2820
英文描述： RF/Microwave mixer/detector diode
中文描述： 射頻/微波混頻器/檢測器二極管
文件頁數： 5/8頁
文件大?。?/td> 143K
代理商： HMPS-2820
5
Assembly Information
The MiniPak diode is mounted to
the PCB or microstrip board using
the pad pattern shown in
Figure10.
0.4
0.4
0.3
0.5
0.3
0.5
Figure 10. PCB Pad Layout, MiniPak
(dimensions in mm).
This mounting pad pattern is
satisfactory for most applications.
However, there are applications
where a high degree of isolation is
required between one diode and
the other is required. For such
applications, the mounting pad
pattern of Figure 11 is
recommended.
2.60
0.40
0.20
0.40 mm via hole
(4 places)
0.8
2.40
Figure 11. PCB Pad Layout, High Isolation
MiniPak (dimensions in mm).
This pattern uses four via holes,
connecting the crossed ground
strip pattern to the ground plane
of the board.
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the MiniPak
package, will reach solder reflow
temperatures faster than those
with a greater mass.
Agilent’s diodes have been quali-
fied to the time-temperature
profile shown in Figure 12. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
MAX
) should not
exceed 255
°
C.
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum temperatures
and times necessary to achieve a
uniform reflow of solder.
TIME (seconds)
T
°
C
0
0
50
100
150
200
221
300
250
350
60
90
30
Preheat 130–170
°
C
Min. 60 s
Max. 150 s
Reflow Time
Min. 60 s
Max. 90 s
Peak Temperature
Min. 240
°
C
Max. 255
°
C
150
180
210
240
270
300
360
120
330
Figure 12. Surface Mount Assembly Temperature Profile.
相關PDF資料
PDF描述
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相關代理商/技術參數
參數描述
HMPS-2820-BLK 功能描述:肖特基二極管與整流器 15 VBR 1.0 pF RoHS:否 制造商:Skyworks Solutions, Inc. 產品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel
HMPS-2820-TR1 功能描述:肖特基二極管與整流器 15 VBR 1.0 pF RoHS:否 制造商:Skyworks Solutions, Inc. 產品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel
HMPS-2820-TR2 功能描述:肖特基二極管與整流器 15 VBR 1.0 pF RoHS:否 制造商:Skyworks Solutions, Inc. 產品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel
HMPS-2822 制造商:AGILENT 制造商全稱:AGILENT 功能描述:MiniPak Surface Mount RF Schottky Barrier Diodes
HMPS-2822-BLK 功能描述:肖特基二極管與整流器 15 VBR 1.0 pF RoHS:否 制造商:Skyworks Solutions, Inc. 產品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel
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