- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄370642 > HMMC-2027 DC-26.5 GHz SPDT GaAs MMIC Switch(DC-26.5 GHz 單刀雙擲砷化鎵單片微波集成電路開關(guān)) PDF資料下載
參數(shù)資料
| 型號： | HMMC-2027 |
| 英文描述： | DC-26.5 GHz SPDT GaAs MMIC Switch(DC-26.5 GHz 單刀雙擲砷化鎵單片微波集成電路開關(guān)) |
| 中文描述： | 的DC - 26.5 GHz的單刀雙擲GaAs MMIC開關(guān)（直流26.5 GHz的單刀雙擲砷化鎵單片微波集成電路開關(guān)） |
| 文件頁數(shù)： | 1/6頁 |
| 文件大?。?/td> | 79K |
| 代理商： | HMMC-2027 |
DC –26.5 GHz SPDT GaAs MMIC
Switch
Technical Data
HMMC-2027
Features
Outputs Terminated in 50
When Off
Frequency Range:
DC-26.5 GHz
Insertion Loss:
2.5dB @ 26.5 GHz
Isolation:
>70 dB @ 45 MHz
30 dB @ 26.5 GHz
Return Loss:
15 dB (Both Input and Selected
Output)
12 dB Unselected Output
Switching Speed:
<1 ns (10%-90% RF)
P
-1dB
:
18 dBm @ 10 MHz
27 dBm @ 2 GHz
Harmonics ( DC Coupled) :
<-45 dBc @ 10 MHz and 5 dBm
<-65 dBc @ 2 GHz and 5 dBm
Description
The HMMC-2027 is a GaAs
monolithic microwave integrated
circuit (MMIC) designed for low
insertion loss and high isolation
from DC to 26.5 GHz. It is
intended for use as a general-
purpose, single-pole, double-
throw (SPDT), absorptive switch.
Two series and two shunt
MESFETs per throw provide 3 dB
maximum insertion loss and
30 dB minimum isolation at
26.5 GHz. HMMC-2027 chips use
through-substrate vias to provide
ground connections to the chip
backside and minimize the
number of wire bonds required.
Chip Size:
Chip Size Tolerance:
Chip Thickness:
Pad Dimensions:
900 x 960
μ
m (35.4 x 37.8 mils)
±
10
μ
m (
±
0.4 mils)
127
±
15
μ
m (5.0
±
0.6 mils)
80 x 80
μ
m (3.2 x 3.2 mils), or larger
Absolute Maximum Ratings
[1]
Symbol
Parameters/Conditions
V
sel
Select Voltages 1 and 2
P
in
RF Input Power
T
op
Operating Temperature
T
STG
Storage Temperature
T
max
Maximum Assembly Temp.
P
unsel[2]
Power into Unselected Output
Notes:
1. Operation in excess of any one of these conditions may result in permanent
damage to this device. T
A
= 25
°
C except for T
op
, T
STG
, and T
max
.
2. Operation in excess of these @ T
op-max
may result in permanent damage.
Units
V
Min.
-10.5
Max.
+3
dBm
°
C
°
C
°
C
dBm
25
-55
+125
-65
+165
+200
15
RF
IN
RF
OUT2
CHIP ID
RF
OUT1
SEL1
SEL2
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HMMC-3002 | DC-16 GHz GaAs HBT MMIC Divide-by-2 Prescaler(DC-16 GHz 砷化鎵HBT單片微波集成電路除2定標(biāo)器) |
| HMMC-3004 | DC-16 GHz GaAs HBT MMIC Divide-by-4 Prescaler(DC-16 GHz 砷化鎵HBT單片微波集成電路除4定標(biāo)器) |
| HMMC-3008 | DC-16 GHz GaAs HBT MMIC Divide-by-8 Prescaler(DC-16 GHz 砷化鎵HBT單片微波集成電路除8定標(biāo)器) |
| HMMC-3022 | DC-12 GHz High Efficiency GaAs HBT MMIC Divide-by-2 Prescaler(DC-12 GHz 高效砷化鎵HBT單片微波集成電路除2定標(biāo)器) |
| HMMC-3024 | DC-12 GHz High Efficiency GaAs HBT MMIC Divide-by-4 Prescaler(DC-12 GHz 高效砷化鎵HBT單片微波集成電路除4定標(biāo)器) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMMC-3002 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/2 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3004 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/4 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3008 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/8 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3022 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/2 12000MHZ - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3024 | 功能描述:預(yù)定標(biāo)器 Chip GaAs 12 GHz RoHS:否 制造商:ON Semiconductor 最大工作頻率:1100 MHz 最小工作頻率:100 MHz 電源電壓-最小:4.5 V 電源電壓-最大:5.5 V 工作電源電壓:5 V 最小工作溫度:- 40 C 最大工作溫度:+ 85 C 封裝:Tube |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。