參數(shù)資料
型號: HMC494LP3
廠商: 美國訊泰微波有限公司上海代表處
英文描述: SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 18 GHz
中文描述: 貼片砷化鎵HBT MMIC的分頻8,直流- 18吉赫
文件頁數(shù): 3/6頁
文件大小: 253K
代理商: HMC494LP3
MICROWAVE CORPORATION
10 - 132
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
F
10
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 18 GHz
HMC494LP3
Absolute Maximum Ratings
Outline Drawing
Typical Supply Current vs. Vcc
Note: Divider will operate over full voltage range shown above
v01.0604
RF Input (Vcc = +5V)
+13 dBm
Supply Voltage (Vcc1, Vcc2)
+5.5V
Channel Temperature (Tc)
135 °C
Continuous Pdiss (T = 85 °C)
(derate 11.9 mW/° C above 85 °C)
593 mW
Thermal Resistance (R
)
(junction to ground paddle)
84 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
NOTES:
1. MATERIAL PACKAGE BODY: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY
3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
6. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB
LAND PATTERN.
Vcc1, Vcc2 (V)
Icc (mA)
4.75
90
5.0
103
5.25
115
-500
-400
-300
-200
-100
0
100
200
300
400
500
22.7 22.9 23.1 23.3 23.5 23.7 23.9 24.1 24.3 24.5 24.7
A
TIME (nS)
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