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參數(shù)資料
| 型號： | HMC424 |
| 廠商： | 美國訊泰微波有限公司上海代表處 |
| 元件分類： | FPGA |
| 英文描述： | 600000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| 中文描述： | 0.5dB的LSB的砷化鎵MMIC的6位數(shù)字衰減器，直流- 13千兆赫 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 213K |
| 代理商： | HMC424 |
MICROWAVE CORPORATION
2 - 12
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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HMC424
0.5dB LSB GaAs MMIC 6-BIT DIGITAL
ATTENUATOR, DC - 13 GHz
v02.0404
Suggested Driver Circuit
(One Circuit Required Per Bit Control Input)
Simple driver using inexpensive standard logic ICs provides fast switching using minimum DC current.
* Recommended value to suppress unwanted RF signals at V1 - V6 control lines.
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling,
Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF
to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised
0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to
attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached
to the ground plane (Figure 2).
Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typical die-to-
substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils).
Assembly Diagram
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PDF描述 |
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| HMC424G16 | 0.5dB LSB GaAs MMIC 6-BIT DIGITAL ATTENUATOR, DC - 3 GHz |
| HMC424LP3 | 0.5dB LSB GaAs MMIC 6-BIT DIGITAL ATTENUATOR, DC - 13 GHz |
| HMC425LP3 | 0.5 dB LSB GaAs MMIC 6-BIT DIGITAL POSITIVE CONTROL ATTENUATOR, 2.4 - 8.0 GHz |
| HMC425 | 0.5 dB LSB GaAs MMIC 6-BIT DIGITAL POSITIVE CONTROL ATTENUATOR, 2.4 - 8.0 GHz |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMC424_09 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:0.5dB LSB GaAs MMIC 6-BIT DIGITAL ATTENUATOR, DC - 13 GHz |
| HMC424A | 功能描述:ATTENUATOR DGTL 6BIT DIE 制造商:analog devices inc. 系列:- 零件狀態(tài):在售 衰減值:3dB 頻率范圍:0Hz ~ 13GHz 功率（W）:- 封裝/外殼:模具 標(biāo)準(zhǔn)包裝:50 |
| HMC424AG16 | 功能描述:ATTENUATOR DGTL 6BIT DIE 制造商:analog devices inc. 系列:- 零件狀態(tài):在售 衰減值:3dB 頻率范圍:0Hz ~ 13GHz 功率（W）:- 封裝/外殼:16-LQFP 標(biāo)準(zhǔn)包裝:1 |
| HMC424ALH5 | 功能描述:ATTENUATOR DGTL 6BIT 12CLCC 制造商:analog devices inc. 系列:- 零件狀態(tài):在售 衰減值:31.5dB 頻率范圍:0Hz ~ 13GHz 功率（W）:- 封裝/外殼:12-CLCC 裸露焊盤 標(biāo)準(zhǔn)包裝:1 |
| HMC424ALH5TR | 功能描述:RF Attenuator 31.5dB ±0.5dB 0 ~ 13GHz 12-VFQFN Exposed Pad 制造商:analog devices inc. 系列:- 零件狀態(tài):新產(chǎn)品 衰減值:31.5dB 容差:±0.5dB 頻率范圍:0 ~ 13GHz 功率（W）:- 阻抗:- 封裝/外殼:12-VFQFN 裸露焊盤 標(biāo)準(zhǔn)包裝:1 |
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