參數(shù)資料
型號(hào): HMC390LP4
廠商: 美國(guó)訊泰微波有限公司上海代表處
英文描述: XCV600E-7FGG680I - NOT RECOMMENDED for NEW DESIGN
中文描述: MMIC VCO的瓦特/緩沖放大器,3.55 - 3.9吉赫
文件頁(yè)數(shù): 3/6頁(yè)
文件大?。?/td> 281K
代理商: HMC390LP4
MICROWAVE CORPORATION
15 - 40
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
V
15
MMIC VCO w/ BUFFER
AMPLIFIER, 3.55 - 3.9 GHz
HMC390LP4
v01.0604
Absolute Maximum Ratings
Outline Drawing
Vcc
+3.5 Vdc
Vtune
0 to +11V
Channel Temperature
135 °C
Continuous Pdiss (T = 85°C)
(derate 6.28 mW/°C above 85°C)
565 W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Typical Supply Current vs. Vcc
Note: VCO will operate over full voltage range shown above.
Vcc (V)
Icc (mA)
2.75
35
3.0
42
3.25
47
NOTES:
1. MATERIAL PACKAGE BODY: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY
3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
6. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB
LAND PATTERN.
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