參數(shù)資料
型號： HMC335G16
廠商： 美國訊泰微波有限公司上海代表處
元件分類： FPGA
英文描述： 600,000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
中文描述： 砷化鎵微波單片集成電路1dB的LSB的5位數(shù)字衰減器，直流- 3千兆赫
文件頁數(shù)： 4/6頁
文件大?。?/td> 238K
代理商： HMC335G16
MICROWAVE CORPORATION
9 - 59
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
A
9
1dB LSB GaAs MMIC 5-BIT DIGITAL
ATTENUATOR, DC - 3 GHz
v00.1102
HMC335G16
Outline Drawing
Pin Number
Function
Description
Interface Schematic
1
Vee
Supply Voltage -5V ±10%
2, 4-9, 11
GND
Package bottom must also be connected to RF ground.
3, 10
RF1, RF2
These pins are DC coupled and matched to 50 Ohm.
Blocking capacitors are required.
12-16
V1-V5
See truth table and control voltage table.
Pin Descriptions
NOTES:
1. PACKAGE MATERIAL: ALUMINA LOADED BOROSILICATE GLASS.
2. LEADS, BASE, COVER MATEIRAL: KOVARTM (#7052 CORNING).
3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN.,
OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN.
4. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. TOLERANCES: 0.005 [.013] UNLESS OTHERWISE SPECIFIED.
6. CHARACTERS TO BE HELVETICA MEDIUM .030 HIGH,
BLACK INK, LOCATED APPROX. AS SHOWN.
7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
相關(guān)PDF資料
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HMC335G16_08 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:1dB LSB GaAs MMIC 5-BIT DIGITAL ATTENUATOR, DC - 3 GHz
HMC336MS8G 制造商:Hittite Microwave Corp 功能描述:0 MHz - 6000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 2 dB INSERTION LOSS
HMC336MS8G_07 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SPDT NON-REFLECTIVE POSITIVE CONTROL SWITCH, DC* - 6.0 GHz
HMC336MS8G_08 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SPDT NON-REFLECTIVE POSITIVE CONTROL SWITCH, DC* - 6 GHz
HMC336MS8GE 功能描述:IC POS CTRL SW SPDT 8MSOP RoHS:是 類別:RF/IF 和 RFID >> RF 開關(guān) 系列:- 標(biāo)準(zhǔn)包裝:25,000 系列:* RF 型:通用 頻率:0Hz ~ 3GHz 特點(diǎn):SPDT 封裝/外殼:6-XFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:TSLP-7 包裝:帶卷 (TR) 其它名稱:SP000671392
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