參數(shù)資料
型號(hào): HMC332
廠商: 美國(guó)訊泰微波有限公司上海代表處
元件分類: FPGA
英文描述: 600000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
中文描述: GaAs MMIC混頻器瓦特/集成了LO放大器,2.0 - 2.8吉赫
文件頁數(shù): 4/6頁
文件大?。?/td> 248K
代理商: HMC332
MICROWAVE CORPORATION
12 - 151
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
M
12
HMC332
GaAs MMIC MIXER w/ INTEGRATED
LO AMPLIFIER, 2.0 - 2.8 GHz
v00.0901
Harmonics of LO
MxN Spurious @ IF Port
nLO
mRF
0
1
2
3
4
0
xx
-11
8
8
43
1
12
0
31
34
48
2
41
35
39
32
45
3
>74
64
>74
50
67
4
>74
>74
>74
71
67
RF = 2.5 GHz @ -10 dBm
LO = 2.4 GHz @ 0 dBm
All values in dBc below IF power level.
nLO Spur @ RF Port
LO Freq. (GHz)
1
2
3
4
2
24
6
19
32
2.2
20
7
18
44
2.4
20
9
22
43
2.6
19
13
18
40
2.8
14
18
21
38
3
11
15
24
39
LO = 0 dBm
All values in dBc below input LO level @ RF port.
Absolute Maximum Ratings
Outline Drawing
RF / IF Input (Vdd = +3V)
+13 dBm
LO Drive (Vdd = +3V)
+13 dBm
Vdd
5.5V
Continuous Pdiss (Ta = 85 °C)
(derate 2.64 mW/°C above 85 °C)
238 mW
IF DC Current
±3 mA
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEADFRAME MATERIAL: COPPER ALLOY
3. LEADFRAME PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
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