參數(shù)資料
型號: HMC276LP4
廠商: 美國訊泰微波有限公司上海代表處
英文描述: GaAs MMIC 4x2 SWITCH MATRIX, 0.2 - 3.0 GHz
中文描述: 砷化鎵微波單片集成電路4x2開關(guān)矩陣,0.2 - 3.0吉赫
文件頁數(shù): 6/8頁
文件大?。?/td> 519K
代理商: HMC276LP4
S
8
8 - 143
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Outline Drawing
Bias Voltage Range (Vdd)
+8.0 Vdc
Control Voltage Range
(All Logic Lines)
Vdd +0.5 to -0.2V Vdc
Channel Temperature
150 °C
Thermal Resistance
325 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Maximum Input Power (Each Input)
+23 dBm (200 - 2150 MHz)
NOTES:
1. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAX.
PAD BURR HEIGHT SHALL BE 0.05mm MAX.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL NC LEADS, GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
HMC276LP4
/
HMC276LP4E
GaAs MMIC 4x2 SWITCH
MATRIX, 0.2 - 3.0 GHz
v00.0505
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC276LP4
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
H276
XXXX
HMC276LP4E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
H276
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
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