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參數(shù)資料
| 型號： | HMC266 |
| 廠商： | 美國訊泰微波有限公司上海代表處 |
| 元件分類： | FPGA |
| 英文描述： | 600000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| 中文描述： | 砷化鎵微波單片集成電路二次諧波泵混合器，20 - 40千兆赫 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 168K |
| 代理商： | HMC266 |
MICROWAVE CORPORATION
5 - 68
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
M
5
MMIC Assembly Techniques
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting,
Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and
from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6
mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4
mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2).
Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate
spacing is 0.076mm (3 mils). Gold ribbon of 0.076 mm x 0.013 mm (3 mil x 0.5 mil) of minimal length <0.31 mm (<12 mils) is recom-
mended to minimize inductance on the RF ports.
HMC266
v01.0300
GaAs MMIC SUB-HARMONICALLY
PUMPED MIXER, 20 - 40 GHz
Ribbon Bond
Ribbon Bond
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| HMC270MS8G | 600000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HMC266_06 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 20 - 40 GHz |
| HMC266_09 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 20 - 40 GHz |
| HMC268LM1 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:SMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz |
| HMC268LM1_01 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:SMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz |
| HMC26DRAH | 功能描述:CONN EDGECARD 52POS R/A .100 SLD RoHS:是 類別:連接器，互連式 >> Card Edge 系列:- 標準包裝:1 系列:- 卡類型:非指定 - 雙邊 類型:母頭 Number of Positions/Bay/Row:43 位置數(shù):86 卡厚度:0.062"（1.57mm） 行數(shù):2 間距:0.156"（3.96mm） 特點:- 安裝類型:通孔 端子:焊接 觸點材料:磷青銅 觸點表面涂層:金 觸點涂層厚度:30µin（0.76µm） 觸點類型：:環(huán)形波紋管 顏色:綠 包裝:托盤 法蘭特點:頂部安裝開口，螺紋插件，4-40 材料 - 絕緣體:聚苯硫醚（PPS） 工作溫度:-65°C ~ 125°C 讀數(shù):雙 |
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