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參數(shù)資料
| 型號： | HMC264 |
| 廠商： | 美國訊泰微波有限公司上海代表處 |
| 英文描述： | GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 20 - 32 GHz |
| 中文描述： | 砷化鎵微波單片集成電路二次諧波泵混合器，20 - 32千兆赫 |
| 文件頁數(shù)： | 8/8頁 |
| 文件大?。?/td> | 341K |
| 代理商： | HMC264 |
MICROWAVE CORPORATION
12 - 93
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
M
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GaAs MMIC SUB-HARMONIC
SMT MIXER, 20 - 30 GHz
v01.1201
HMC264LM3
HMC264LM3 Recommended SMT Attachment Technique
Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting
The HMC LM3 package was designed to be compatible with
high volume surface mount PCB assembly processes. The
LM3 package requires a specific mounting pattern to allow
proper mechanical attachment and to optimize electrical per-
formance at millimeterwave frequencies. This PCB layout pat-
tern can be found on each LM3 product data sheet. It can also
be provided as an electronic drawing upon request from Hittite
Sales & Application Engineering.
Follow these precautions to avoid permanent damage:
Cleanliness:
Observe proper handling procedures to ensure
clean devices and PCBs. LM3 devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.
Static Sensitivity:
Follow ESD precautions to protect against ESD strikes.
General Handling:
Handle the LM3 package on the top with a vacuum collet or along the edges with a sharp pair of bent
tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to
the top of the lid.
Solder Materials & Temperature Profile: Follow the information contained in the application note. Hand soldering is not
recommended. Conductive epoxy attachment is not recommended.
Solder Paste
Solder paste should be selected based on the user’s experience and be compatible with the metallization systems used.
See the LM3 data sheet Outline drawing for pin & ground contact metallization schemes.
Solder Paste Application
Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder paste
will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical
performance. Excess solder may create unwanted electrical parasitics at high frequencies.
Solder Reflow
The soldering process is usually accomplished in a reflow oven but may also use a vapor phase process. A solder
reflow profile is suggested above.
Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and vary-
ing component masses. The final profile should be determined by mounting the thermocouple to the PCB at the location
of the device.
Follow solder paste and oven vendor’s recommendations when developing a solder reflow profile. A standard profile
will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.
Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to evaporate and the
flux to completely activate. Reflow must then occur prior to the flux being completely driven off. The duration of peak
reflow temperature should not exceed 15 seconds. Packages have been qualified to withstand a peak temperature of
235°C for 15 seconds. Verify that the profile will not expose device to temperatures in excess of 235°C.
Cleaning
A water-based flux wash may be used.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMC264_08 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 20 - 32 GHz |
| HMC264_09 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 20 - 32 GHz |
| HMC264CB1 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog IC |
| HMC264LC3B | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONIC SMT MIXER, 21 - 31 GHz |
| HMC264LC3B_09 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONIC SMT MIXER, 21 - 31 GHz |
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