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參數(shù)資料
| 型號(hào)： | HMC240 |
| 廠商： | 美國(guó)訊泰微波有限公司上海代表處 |
| 元件分類： | FPGA |
| 英文描述： | 50000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| 中文描述： | 砷化鎵微波單片集成電路單刀雙擲開關(guān)直流- 4.0吉赫 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大小： | 115K |
| 代理商： | HMC240 |
MICROWAVE CORPORATION
7 - 12
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
S
7
HMC240
GaAs MMIC SPDT SWITCH
DC - 4.0 GHz
v00.0403
Assembly Diagram
Handling Precautions
Follow these precautions to avoid permanent damage.
Cleanliness:
Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity:
Follow ESD precautions to protect against > ± 250V ESD strikes.
Transients:
Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize
inductive pick-up.
General Handling:
Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the
chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean and
flat.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of
150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum
level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or
substrate. All bonds should be as short as possible <0.31mm (12 mils).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMC240_10 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SPDT SWITCH DC - 4 GHz |
| HMC240A | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SPDT SWITCH DC - 4 GHz |
| HMC241ALP3E | 功能描述:RF Switch IC WiMAX / WiBro SP4T 4GHz 50 Ohm 16-SMT (3x3) 制造商:analog devices inc. 系列:- 包裝:剪帶 零件狀態(tài):有效 頻率?- 下:0Hz 頻率?- 上:4GHz 隔離 @ 頻率:32dB @ 4GHz（標(biāo)準(zhǔn)） 插損 @ 頻率:1.2dB @ 4GHz IIP3:47dBm（標(biāo)準(zhǔn)） 拓?fù)?吸收性 電路:SP4T P1dB:29dBm 特性:- 阻抗:50 歐姆 工作溫度:* 電壓 - 電源:5V RF 類型:WiMAX / WiBro 封裝/外殼:16-VFQFN 裸露焊盤 供應(yīng)商器件封裝:16-SMT（3x3） 標(biāo)準(zhǔn)包裝:1 |
| HMC241ALP3ETR | 功能描述:RF Switch IC WiMax, WLAN SP4T 4GHz 50 Ohm 16-SMT (3x3) 制造商:analog devices inc. 系列:- 包裝:剪切帶（CT） 零件狀態(tài):有效 頻率?- 下:0Hz 頻率?- 上:4GHz 隔離 @ 頻率:32dB @ 4GHz（標(biāo)準(zhǔn)） 插損 @ 頻率:1.2dB @ 4GHz IIP3:47dBm（標(biāo)準(zhǔn)） 拓?fù)?反射 電路:SP4T P1dB:- 特性:- 阻抗:50 歐姆 工作溫度:-40°C ~ 85°C 電壓 - 電源:5V RF 類型:WiMax，WLAN 封裝/外殼:16-VFQFN 裸露焊盤 供應(yīng)商器件封裝:16-SMT（3x3） 標(biāo)準(zhǔn)包裝:1 |
| HMC241AQS16 | 功能描述:RF Switch IC CATV SP4T 3.5GHz 50 Ohm 16-QSOP 制造商:analog devices inc. 系列:- 包裝:剪帶 零件狀態(tài):有效 頻率?- 下:0Hz 頻率?- 上:3.5GHz 隔離 @ 頻率:36dB @ 2.5GHz（標(biāo)準(zhǔn)） 插損 @ 頻率:0.8dB @ 2.5GHz IIP3:48dBm（標(biāo)準(zhǔn)） 拓?fù)?吸收性 電路:SP4T P1dB:29dBm 特性:- 阻抗:50 歐姆 工作溫度:-40°C ~ 85°C 電壓 - 電源:5V RF 類型:CATV 封裝/外殼:16-SSOP（0.154"，3.90mm 寬） 供應(yīng)商器件封裝:16-QSOP 標(biāo)準(zhǔn)包裝:1 |
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