- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄367207 > HMC205 (美國訊泰微波有限公司上海代表處) GaAs MMIC PASSIVE FREQUENCY DOUBLER, 6 - 12 GHz INPUT PDF資料下載
參數(shù)資料
| 型號： | HMC205 |
| 廠商： | 美國訊泰微波有限公司上海代表處 |
| 英文描述： | GaAs MMIC PASSIVE FREQUENCY DOUBLER, 6 - 12 GHz INPUT |
| 中文描述： | 砷化鎵微波單片集成電路被動倍頻，6 - 12 GHz的輸入 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 183K |
| 代理商： | HMC205 |
MICROWAVE CORPORATION
4 - 20
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
F
4
Handling Precautions
Follow these precautions to avoid permanent damage.
Cleanliness:
Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid clean-
ing systems.
Static Sensitivity:
Follow ESD precautions to protect against > ± 250V ESD strikes.
Transients
: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and
bias cables to minimize inductive pick-up.
General Handling:
Handle the chip along the edges with a vacuum collet or with a sharp pair of bent
tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet,
tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically con-
ductive epoxy. The mounting surface should be clean and flat.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around
the perimeter of the chip once it is placed into position.
Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding wiht a nominal stage tem-
perature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams
is recommended. Use the minimum level of ultrasonic energry to achieve reliable wirebonds. Wirebonds
should be started on the chip and terminated on the package. RF bonds should be as short as possible.
v02.1201
HMC205
GaAs MMIC FREQUENCY
DOUBLER, 6 - 12 GHz INPUT
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HMC207S8 | 50000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| HMC208MS8 | GaAs MMIC SMT DOUBLEBALANCED MIXER, 0.7 - 2.0 GHz |
| HMC210MS8 | 50,000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| HMC213MS8E | GaAs MMIC SMT DOUBLE BALANCED MIXER, 1.5 - 4.5 GHz |
| HMC214MS8 | HIGH IP3 GaAs MMIC MIXER, 2.4 - 4.0 GHz |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMC205_09 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC PASSIVE FREQUENCY DOUBLER, 6 - 12 GHz INPUT |
| HMC207AS8 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT Double-Ba lanced Mixer, 0.7 - 2.0 GHz |
| HMC207AS8E | 制造商:Hittite Microwave Corp 功能描述:IC MIXER DBL-BAL 0.7-2GHZ 8-SOIC |
| HMC207S8 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT DOUBLEBALANCED MIXER, 0.7 - 2.0 GHz |
| HMC207S8_06 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT DOUBLEBALANCED MIXER, 0.7 - 2.0 GHz |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。