參數(shù)資料
型號: HMC157C8
廠商: 美國訊泰微波有限公司上海代表處
英文描述: GaAs MMIC SMT FREQUENCY DOUBLER 1 - 2 GHz INPUT
中文描述: 砷化鎵微波單片集成電路表面貼裝倍頻1 - 2 GHz的輸入
文件頁數(shù): 3/4頁
文件大?。?/td> 69K
代理商: HMC157C8
MICROWAVE CORPORATION
F
EBRUARY
2001
3 - 16
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343
Fax: 978-250-3373
Web Site: www.hittite.com
M
U
3
S
Schematic
Absolute Maximum Ratings
Input Drive
Storage Temperature
Operating Temperature
+27 dBm
-65 to +150 deg C
-55 to +125 deg C
Outline Drawing
RF
OUT
RF
IN
PIN 1
PIN 8
CHAMFERED
0 DEG.
TO 7 DEG.
RF GND PLANE
COPLANAR WITH LEADS
0.157/0.163
(3.99/4.14)
0.282/0.298
(7.16/7.57)
(0.18/0.23)
(0.51/1.02)
(2.41)
COPLANARITY
MAX.
0.197/0.203
(5.00/5.16)
(0.18/0.23)
(0.51 +/- 0.08)
(1.27)
(3.48/3.63)
0.137/0.143
0.020 +/- 0.003 TYP
0.007/0.009 TYP
0.020/0.040
0.050 TYP
0.177/0.183
0.095
0.004 (0.10)
MAX.
GaAs MMIC SMT FREQUENCY DOUBLER 1 - 2 GHz INPUT
RF OUT
(PIN 7)
RF IN
(PIN 2)
1.
MATERIAL:
A) PACKAGE BODY & COVER : WHITE ALUMINA (92%)
B) LEADS & PACKAGE BOTTOM: COPPER
PLATING : ELECTROLYTIC GOLD 100 - 200 MICROINCHES
OVER ELECTROLYTIC NICKEL 100 TO 200 MICROINCHES.
DIMENSIONS ARE IN INCHES (MILLIMETERS).
UNLESS OTHERWISE SPECIFIED TOL. ARE ±0.005(±0.13).
ALL UNLABELED LEADS ARE GROUND. THESE LEADS ARE
CONNECTED INTERNALLY TO THE PACKAGED BOTTOM GROUND.
THE PACKAGE BOTTOM RF GROUND
MUST
BE SOLDERED TO
THE PCB RF GROUND.
PACKAGE LENGTH AND WIDTH DIMENSIONS SHOWN DO NOT INCLUDE
LID SEAL PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.005
(0.127MM) PER SIDE.
2 .
3.
4.
5.
HMC157C8
V01.0700
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HMC158C8 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT
HMC158C8_06 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT
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