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參數(shù)資料
| 型號： | HMC156 |
| 廠商： | 美國訊泰微波有限公司上海代表處 |
| 元件分類： | FPGA |
| 英文描述： | 50,000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| 中文描述： | 砷化鎵微波單片集成電路被動倍頻器，0.7 - 2.4 GHz的輸入 |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 83K |
| 代理商： | HMC156 |
MICROWAVE CORPORATION
4 - 5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
F
4
v03.1203
HMC156
GaAs MMIC FREQUENCY
DOUBLER, 0.7 - 2.4 GHz INPUT
Handling Precautions
Follow these precautions to avoid permanent damage.
Cleanliness:
Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid clean-
ing systems.
Static Sensitivity:
Follow ESD precautions to protect against > ± 250V ESD strikes.
Transients
: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and
bias cables to minimize inductive pick-up.
General Handling:
Handle the chip along the edges with a vacuum collet or with a sharp pair of bent
tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet,
tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or
with electrically conductive epoxy. The mounting surface should be clean and flat.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around
the perimeter of the chip once it is placed into position.
Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a nominal stage tem-
perature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams
is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds
should be started on the chip and terminated on the package. RF bonds should be as short as possible.
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相關代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMC156A | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT |
| HMC156AC8 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT |
| HMC156AC8TR | 功能描述:RF IC Doubler VSAT, DBS 700MHz ~ 2.4GHz 8-SMT 制造商:analog devices inc. 系列:- 包裝:剪切帶（CT） 零件狀態(tài):過期 功能:倍增器 頻率:700MHz ~ 2.4GHz RF 類型:VSAT，DBS 輔助屬性:- 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商器件封裝:8-SMT 標準包裝:1 |
| HMC156C8 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT |
| HMC156C8_06 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 0.7 - 2.4 GHz INPUT |
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