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參數(shù)資料
| 型號(hào)： | HMC135 |
| 廠商： | 美國(guó)訊泰微波有限公司上海代表處 |
| 英文描述： | GaAs MMIC BI-PHASE MODULATOR, 1.8 - 5.2 GHz |
| 中文描述： | 砷化鎵微波單片集成電路雙相位調(diào)制器，1月8日至5月2日吉赫 |
| 文件頁(yè)數(shù)： | 4/4頁(yè) |
| 文件大?。?/td> | 122K |
| 代理商： | HMC135 |
MICROWAVE CORPORATION
6 - 5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
6
M
HMC135
GaAs MMIC BI-PHASE
MODULATOR, 1.8 - 5.2 GHz
v02.0304
Outline Drawing
Suggested TTL Driver for a Bi-Phase Modulator
Notes
1. V
A
Alternates Between
+ 2.4 V
dc
± I
A
= 2.4 - 0.6 = ± 5 mA
360 Ohm
2. HCT04 and HC04 are QMOS HEX
Inverters.
*R
1
=300 to 620 ± 2% Select R
1
To
Supply ±3 to ±6 mA to the IF Port.
2.2K
TTL
VCC
GND
GND
VCC
HCT04
HC04
.01 uF
.01 uF
-2.5 Vdc
+2.5 Vdc
+5 Vdc
*R1
MODULATOR
I, Q PORTS
HITTITE
MODULATOR
VA
IA
VZ= 2V
0.6V
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BOND PAD SPACING IS .006” CENTER
TO CENTER.
4. BACKSIDE METALIZATION: GOLD.
5. BACKSIDE METAL IS GROUND.
6. BOND PAD METALIZATION: GOLD.
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMC135_07 | 制造商:HITTITE 制造商全稱(chēng):Hittite Microwave Corporation 功能描述:GaAs MMIC BI-PHASE MODULATOR, 1.8 - 5.2 GHz |
| HMC135_09 | 制造商:HITTITE 制造商全稱(chēng):Hittite Microwave Corporation 功能描述:GaAs MMIC BI-PHASE MODULATOR, 1.8 - 5.2 GHz |
| HMC136 | 制造商:HITTITE 制造商全稱(chēng):Hittite Microwave Corporation 功能描述:GaAs MMIC BI-PHASE MODULATOR, 4 - 8 GHz |
| HMC136_07 | 制造商:HITTITE 制造商全稱(chēng):Hittite Microwave Corporation 功能描述:GaAs MMIC BI-PHASE MODULATOR, 4 - 8 GHz |
| HMC136_09 | 制造商:HITTITE 制造商全稱(chēng):Hittite Microwave Corporation 功能描述:GaAs MMIC BI-PHASE MODULATOR, 4 - 8 GHz |
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