參數(shù)資料
型號(hào): HMC129
廠商: 美國(guó)訊泰微波有限公司上海代表處
英文描述: RESISTOR 47K OHM 1W CARB COMP
中文描述: GaAs MMIC雙平衡混頻器,4 - 8千兆赫
文件頁(yè)數(shù): 5/6頁(yè)
文件大?。?/td> 173K
代理商: HMC129
MICROWAVE CORPORATION
5 - 12
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
M
5
v02.0802
HMC129
GaAs MMIC DOUBLE-BALANCED
MIXER, 4 - 8 GHz
Outline Drawing
Pad Number
Function
Description
Interface Schematic
1
IF
This pin is DC coupled. For applications not requiring opera-
tion to DC, this port should be DC blocked externally using a
series capacitor whose value has been chosen to pass the
necessary IF frequency range. For operation to DC this pin
must not source or sink more than 2mA of current or die non-
function and possible die failure will result.
2
RF
This pin is DC coupled and matched to 50 Ohm
from 4 to 8 GHz.
3
LO
This pin is DC coupled and matched to 50 Ohm
from 4 to 8 GHz.
GND
The backside of the die must connect to RF ground.
Pad Descriptions
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. BOND PADS ARE .004” SQUARE
3. TYPICAL BOND PAD SPACING CENTER TO CENTER
IS .006” EXCEPT AS SHOWN
4. DIE THICKNESS = .004” [.100 MM]
5. BACKSIDE METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. BOND PAD METALIZATION: GOLD
相關(guān)PDF資料
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