參數(shù)資料
型號(hào): HMC128G8
廠(chǎng)商: 美國(guó)訊泰微波有限公司上海代表處
英文描述: GaAs MMIC SMT DOUBLEBALANCED MIXER, 1.8 - 5 GHz
中文描述: 貼片DOUBLEBALANCED砷化鎵MMIC混頻器,1.8 - 5千兆赫
文件頁(yè)數(shù): 5/6頁(yè)
文件大小: 184K
代理商: HMC128G8
MICROWAVE CORPORATION
5 - 6
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
M
5
v02.0802
HMC128
GaAs MMIC DOUBLE-BALANCED
MIXER, 1.8 - 5.0 GHz
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. BOND PADS ARE .004” SQUARE
3. TYPICAL BOND PAD SPACING CENTER TO CENTER
IS .006” EXCEPT AS SHOWN
4. DIE THICKNESS = .004” [.100 MM]
5. BACKSIDE METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. BOND PAD METALIZATION: GOLD
Outline Drawing
Pad Number
Function
Description
Interface Schematic
1
LO
This pin is DC coupled and matched to 50 Ohm
from 1.8 to 5.0 GHz.
2
IF
This pin is DC coupled. For applications not requiring opera-
tion to DC, this port should be DC blocked externally using a
series capacitor whose value has been chosen to pass the
necessary IF frequency range. For operation to DC this pin
must not source or sink more than 2mA of current or die non-
function and possible die failure will result.
3
RF
This pin is DC coupled and matched to 50 Ohm
from 1.8 to 5.0 GHz.
GND
The backside of the die must connect to RF ground.
Pad Descriptions
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