
HM5164805F Series, HM5165805F Series
9
DC Characteristics
(HM5165805F Series)
HM5165805F
-5
-6
Parameter
Symbol Min
Max
Min
Max
Unit
Test conditions
Operating current*
1,
*
2
I
CC1
I
CC2
—
135
—
115
mA
t
RC
= min
TTL interface
RAS
,
CAS
= V
IH
Dout = High-Z
Standby current
—
2
—
2
mA
—
0.5
—
0.5
mA
CMOS interface
RAS
,
CAS
≥
V
CC
– 0.2 V
Dout = High-Z
Standby current
(L-version)
I
CC2
—
300
—
300
μ
A
CMOS interface
RAS
,
CAS
≥
V
CC
– 0.2 V
Dout = High-Z
RAS
-only refresh current*
2
I
CC3
I
CC5
—
135
—
115
mA
t
RC
= min
RAS
= V
,
CAS
= V
IL
Dout = enable
Standby current*
1
—
5
—
5
mA
CAS
-before-
RAS
refresh
current
I
CC6
—
135
—
115
mA
t
RC
= min
EDO page mode current*
1,
*
3
I
CC7
—
110
—
100
mA
RAS
= V
IL
,
CAS
cycle,
t
HPC
= t
HPC
min
CMOS interface
Dout = High-Z
CBR refresh: t
RC
= 15.6
μ
s
t
RAS
≤
0.3
μ
s
CMOS interface
RAS
,
CAS
≤
0.2 V
Dout = High-Z
Battery backup current*
4
(Standby with CBR refresh)
(L-version)
I
CC10
—
1.2
—
1.2
mA
Self refresh mode current
(L-version)
I
CC11
—
500
—
500
μ
A
Input leakage current
I
LI
I
LO
–5
5
–5
5
μ
A
μ
A
0 V
≤
Vin
≤
V
CC
+ 0.3 V
0 V
≤
Vout
≤
V
CC
Dout = disable
Output leakage current
–5
5
–5
5
Output high voltage
V
OH
V
OL
2.4
V
CC
0.4
2.4
V
CC
0.4
V
High Iout = –2 mA
Output low voltage
Notes: 1. I
depends on output load condition when the device is selected. I
CC
max is specified at the
output open condition.
2. Address can be changed once or less while
RAS
= V
IL
.
3. Measured with one sequential address change per EDO cycle, t
HPC
.
4. V
IH
≥
V
CC
– 0.2 V, 0 V
≤
V
IL
≤
0.2 V.
0
0
V
Low Iout = 2 mA