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參數(shù)資料
| 型號： | HLMP-C025-P0000 |
| 元件分類： | LED |
| 英文描述： | T-1 3/4 SINGLE COLOR LED, RED, 5 mm |
| 封裝： | PLASTIC PACKAGE-2 |
| 文件頁數(shù)： | 8/9頁 |
| 文件大?。?/td> | 195K |
| 代理商： | HLMP-C025-P0000 |
8
8
Figure 8. Recommended wave soldering profile.
LAMINAR WAVE
HOT AIR KNIFE
BOTTOM SIDE
TOP SIDE OF
TURBULENT WAVE
FLUXING
PREHEAT
0
10
20
30
50
100
150
200
250
30
40
50
TIME – SECONDS
T
°
C
60
70
80
90
100
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150
C (100
C PCB)
SOLDER WAVE TEMPERATURE = 245
°
C
AIR KNIFE AIR TEMPERATURE = 390
°
C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
Precautions:
Lead Forming
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.
It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
Recommended soldering conditions:
Wave Soldering
Manual Solder
Dipping
Pre-heat Temperature
105°C Max.
–
Pre-heat Time
30 sec Max.
–
Peak Temperature
250°C Max.
260°C Max.
Dwell Time
3 sec Max.
5 sec Max.
Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
Diagonal
Plated Through
Hole Diameter
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HLMP-C025-P0000 | 制造商:Avago Technologies 功能描述:LED Lamp |
| HLMP-C025-P00DD | 功能描述:標(biāo)準(zhǔn)LED-通孔 Red Water Clear 626nm 1000mcd RoHS:否 制造商:Vishay Semiconductors 照明顏色:Red 光強(qiáng)度:0.7 mcd 波長/色溫:615 nm 顯示角:45 deg 透鏡顏色/類型:Clear, Non-Diffused 正向電流:70 mA 正向電壓:1.83 V to 3.03 V LED 大小:2 mm 系列: 封裝:Tube |
| HLMP-C027-P0000 | 功能描述:標(biāo)準(zhǔn)LED-通孔 Red Water Clear 626nm 1000mcd RoHS:否 制造商:Vishay Semiconductors 照明顏色:Red 光強(qiáng)度:0.7 mcd 波長/色溫:615 nm 顯示角:45 deg 透鏡顏色/類型:Clear, Non-Diffused 正向電流:70 mA 正向電壓:1.83 V to 3.03 V LED 大小:2 mm 系列: 封裝:Tube |
| HLMP-C027-P0002 | 制造商:Avago Technologies 功能描述: |
| HLMP-C115 | 功能描述:標(biāo)準(zhǔn)LED-通孔 Red Non-diffused 645nm 600mcd RoHS:否 制造商:Vishay Semiconductors 照明顏色:Red 光強(qiáng)度:0.7 mcd 波長/色溫:615 nm 顯示角:45 deg 透鏡顏色/類型:Clear, Non-Diffused 正向電流:70 mA 正向電壓:1.83 V to 3.03 V LED 大小:2 mm 系列: 封裝:Tube |
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