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參數(shù)資料
| 型號： | HIP6503CBZ-T |
| 廠商： | INTERSIL CORP |
| 元件分類： | 電源管理 |
| 英文描述： | Multiple Linear Power Controller with ACPI Control Interface |
| 中文描述： | 9-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO20 |
| 封裝： | LEAD FREE, PLASTIC, MS-013-AC, SOIC-20 |
| 文件頁數(shù)： | 13/14頁 |
| 文件大?。?/td> | 380K |
| 代理商： | HIP6503CBZ-T |
13
FN4882.5
July 21, 2005
HIP6503 Application Circuit
Figure 12 shows an application circuit of an
ACPI-sanctioned power management system for a
microprocessor computer system. The power supply
provides the 3.3V
DUAL
/3.3V
SB
voltage (V
OUT3
), the ICH2
resume well 1.8V
SB
voltage (V
OUT1
), the RDRAM 2.5V
MEM
memory voltage (V
OUT2
), the 2.5V
CLK
clock voltage
(V
OUT4
), and the 5V
DUAL
voltage (V
OUT5
) from +3.3V,
+5VSB, +5V, and +12VDC ATX supply outputs. Q4 can also
be a PNP, such as an MMBT2907AL. For detailed
information on the circuit, including a Bill-of-Materials and
circuit board description, see Application Note AN9901.
Also see Intersil Corporation’s web page
(www.intersil.com) or call 1 888-INTERSIL for the latest
information.
C9
1
μ
F
C4
1
μ
F
330
μ
F
150
μ
F
330
μ
F
GND
5VSB
+3.3V
IN
+5V
SB
VSEN2
DRV2
C7
HIP6503
12V
+12V
IN
V
OUT2
2.5V
MEM
Q1
2SC5001
V
OUT3
3.3V
DUAL
/3.3V
SB
+5V
IN
C13
V
OUT5
5V
DUAL
3V3DL
3V3DLSB
Q2
Q3
Q4
FDV304P
Q5
DLA
5VDLSB
FAULT/MSEL
5VDL
SS
CONFIGURATION
HARDWARE
EN5VDL
S3
+
+
C3
1
μ
F
C1
1
μ
F
C2
1000
μ
F
+
C8
1
μ
F
+
C14
1
μ
F
2SD1802
SHUTDOWN
(FROM OPEN-DRAIN N-MOS)
1/2 HUF76113DK8
HUF76113T3S
C10
U1
C15
0.1
μ
F
1V8SB
VCLK
V
OUT4
2.5V
CLK
150
μ
F
C11+
C12
1
μ
F
V
OUT1
1.8V
SB
C6
150
μ
F
+
SLP_S3
SLP_S5
FIGURE 12. TYPICAL HIP6503 APPLICATION DIAGRAM
3V3
1V8IN
S5
C5
1
μ
F
5V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
FAULT OUTPUT
R1
1K
HIP6503
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| HIP6521CB | 功能描述:IC REG QD BCK/LINEAR SYNC 16SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 線性 + 切換式 系列:- 標準包裝:2,500 系列:- 拓撲:降壓（降壓）同步（3），線性（LDO）（2） 功能:任何功能 輸出數(shù):5 頻率 - 開關:300kHz 電壓/電流 - 輸出 1:控制器 電壓/電流 - 輸出 2:控制器 電壓/電流 - 輸出 3:控制器 帶 LED 驅動器:無 帶監(jiān)控器:無 帶序列發(fā)生器:是 電源電壓:5.6 V ~ 24 V 工作溫度:-40°C ~ 85°C 安裝類型:* 封裝/外殼:* 供應商設備封裝:* 包裝:* |
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