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參數(shù)資料
| 型號： | HIP6311A |
| 廠商： | Intersil Corporation |
| 元件分類： | FPGA |
| 英文描述： | 150000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN |
| 中文描述： | 微處理器核心電壓調(diào)節(jié)器的多相降壓PWM控制器 |
| 文件頁數(shù)： | 15/16頁 |
| 文件大?。?/td> | 449K |
| 代理商： | HIP6311A |
15
Considerations section. With all else fixed, decreasing the
inductance could increase the power dissipated in the
MOSFETs by 30%.
Input Capacitor Selection
The important parameters for the bulk input capacitors are the
voltage rating and the RMS current rating. For reliable
operation, select bulk input capacitors with voltage and current
ratings above the maximum input voltage and largest RMS
current required by the circuit. The capacitor voltage rating
should be at least 1.25 times greater than the maximum input
voltage and a voltage rating of 1.5 times is a conservative
guideline. The RMS current required for a multi-phase
converter can be approximated with the aid of Figure 13.
First determine the operating duty ratio as the ratio of the
output voltage divided by the input voltage. Find the Current
Multiplier from the curve with the appropriate power
channels. Multiply the current multiplier by the full load
output current. The resulting value is the RMS current rating
required by the input capacitor.
Use a mix of input bypass capacitors to control the voltage
overshoot across the MOSFETs. Use ceramic capacitance for
the high frequency decoupling and bulk capacitors to supply
the RMS current. Small ceramic capacitors should be placed
very close to the drain of the upper MOSFET to suppress the
voltage induced in the parasitic circuit impedances.
For bulk capacitance, several electrolytic capacitors
(Panasonic HFQ series or Nichicon PL series or Sanyo
MV-GX or equivalent) may be needed. For surface mount
designs, solid tantalum capacitors can be used, but caution
must be exercised with regard to the capacitor surge current
rating. These capacitors must be capable of handling the
surge-current at power-up. The TPS series available from
AVX, and the 593D series from Sprague are both surge
current tested.
MOSFET Selection and Considerations
In high-current PWM applications, the MOSFET power
dissipation, package selection and heatsink are the
dominant design factors. The power dissipation includes two
loss components; conduction loss and switching loss. These
losses are distributed between the upper and lower
MOSFETs according to duty factor (see the following
equations). The conduction losses are the main component
of power dissipation for the lower MOSFETs, Q2 and Q4 of
Figure 1. Only the upper MOSFETs, Q1 and Q3 have
significant switching losses, since the lower device turns on
and off into near zero voltage.
The equations assume linear voltage-current transitions and
do not model power loss due to the reverse-recovery of the
lower MOSFETs body diode. The gate-charge losses are
dissipated by the Driver IC and don't heat the MOSFETs.
However, large gate-charge increases the switching time,
t
SW
which increases the upper MOSFET switching losses.
Ensure that both MOSFETs are within their maximum
junction temperature at high ambient temperature by
calculating the temperature rise according to package
thermal-resistance specifications. A separate heatsink may
be necessary depending upon MOSFET power, package
type, ambient temperature and air flow.
A diode, anode to ground, may be placed across Q2 and Q4.
These diodes function as a clamp that catches the negative
inductor swing during the dead time between the turn off of
the lower MOSFETs and the turn on of the upper MOSFETs.
The diodes must be a Schottky type to prevent the lossy
parasitic MOSFET body diode from conducting. It is usually
acceptable to omit the diodes and let the body diodes of the
lower MOSFETs clamp the negative inductor swing, but
efficiency could drop one or two percent as a result. The
diode's rated reverse breakdown voltage must be greater
than the maximum input voltage.
1.0
0.8
0.6
0.4
0.2
0
0
0.1
0.2
0.3
0.4
0.5
DUTY CYCLE (V
O
/V
IN
)
R
P
)
V
O
/
X
S
)
SINGLE
CHANNEL
2 CHANNEL
3 CHANNEL
4 CHANNEL
FIGURE 12. RIPPLE CURRENT vs DUTY CYCLE
0.5
0.4
0.3
0.2
0.1
0
0
0.1
0.2
0.3
0.4
0.5
DUTY CYCLE (V
O
/V
IN
)
C
SINGLE
CHANNEL
3 CHANNEL
4 CHANNEL
2 CHANNEL
FIGURE 13. CURRENT MULTIPLIER vs DUTY CYCLE
P
UPPER
I
------------------------------------------------------------
2
r
IN
×
V
×
I
---------------------------------------------------------
V
×
t
×
F
×
+
=
P
LOWER
I
--------------------------------------------------------------------------------
2
r
IN
×
V
V
–
(
)
×
=
HIP6311A
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| HIP6311ACB | 功能描述:IC REG CTRLR BUCK PWM 20-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 切換控制器 系列:- 標準包裝:4,000 系列:- PWM 型:電壓模式 輸出數(shù):1 頻率 - 最大:1.5MHz 占空比:66.7% 電源電壓:4.75 V ~ 5.25 V 降壓:是 升壓:無 回掃:無 反相:無 倍增器:無 除法器:無 Cuk:無 隔離:無 工作溫度:-40°C ~ 85°C 封裝/外殼:40-VFQFN 裸露焊盤 包裝:帶卷 (TR) |
| HIP6311ACB-T | 功能描述:IC REG CTRLR BUCK PWM 20-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 切換控制器 系列:- 標準包裝:4,000 系列:- PWM 型:電壓模式 輸出數(shù):1 頻率 - 最大:1.5MHz 占空比:66.7% 電源電壓:4.75 V ~ 5.25 V 降壓:是 升壓:無 回掃:無 反相:無 倍增器:無 除法器:無 Cuk:無 隔離:無 工作溫度:-40°C ~ 85°C 封裝/外殼:40-VFQFN 裸露焊盤 包裝:帶卷 (TR) |
| HIP6311ACBZ | 功能描述:電流型 PWM 控制器 C4AM MULTI-PHS CNTRL VID LVLS RoHS:否 制造商:Texas Instruments 開關(guān)頻率:27 KHz 上升時間: 下降時間: 工作電源電壓:6 V to 15 V 工作電源電流:1.5 mA 輸出端數(shù)量:1 最大工作溫度:+ 105 C 安裝風格:SMD/SMT 封裝 / 箱體:TSSOP-14 |
| HIP6311ACBZA | 功能描述:電流型 PWM 控制器 W/ANNEAL C4AM MULTI- PHS CNTRLR LVLS RoHS:否 制造商:Texas Instruments 開關(guān)頻率:27 KHz 上升時間: 下降時間: 工作電源電壓:6 V to 15 V 工作電源電流:1.5 mA 輸出端數(shù)量:1 最大工作溫度:+ 105 C 安裝風格:SMD/SMT 封裝 / 箱體:TSSOP-14 |
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