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參數(shù)資料
| 型號： | HIP6301CBZA-T |
| 廠商： | INTERSIL CORP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller |
| 中文描述： | SWITCHING CONTROLLER, 1500 kHz SWITCHING FREQ-MAX, PDSO20 |
| 封裝： | LEAD FREE, PLASTIC, MS-013-AC, SOIC-20 |
| 文件頁數(shù)： | 14/17頁 |
| 文件大?。?/td> | 406K |
| 代理商： | HIP6301CBZA-T |
14
FN4765.6
December 27, 2004
the sampled current (I
SAMPLE
) can be related to the load
current (I
LT
) by:
I
SW
Where: I
LT
= total load current
n = the number of channels
Example: Using the previously given conditions, and
ForI
LT
= 100A,
n = 4
Then I
SAMPLE
= 25.49A
As discussed previously, the voltage drop across each Q2
transistor at the point in time when current is sampled is
r
DSON
(Q2) x
I
SAMPLE
. The voltage at Q2’s drain, the
PHASE node, is applied through the R
ISEN
resistor to the
HIP6301 ISEN pin. This pin is held at virtual ground, so the
current into ISEN is:
I
ISEN
Example: From the previous conditions,
where I
LT
= 100A,
I
SAMPLE
= 25.49A,
r
DS(ON)
(Q2)
= 4m
Then: R
ISEN
= 2.04K and
I
CURRENT TRIP
= 165%
Short circuit I
LT
= 165A.
Channel Frequency Oscillator
The channel oscillator frequency is set by placing a resistor,
R
T
, to ground from the FS/DIS pin. Figure 10 is a curve
showing the relationship between frequency, F
SW,
and
resistor R
T
. To avoid pickup by the FS/DIS pin, it is important
to place this resistor next to the pin.
Layout Considerations
MOSFETs switch very fast and efficiently. The speed with
which the current transitions from one device to another
causes voltage spikes across the interconnecting
impedances and parasitic circuit elements. These voltage
spikes can degrade efficiency, radiate noise into the circuit
and lead to device overvoltage stress. Careful component
layout and printed circuit design minimizes the voltage
spikes in the converter. Consider, as an example, the turnoff
transition of the upper PWM MOSFET. Prior to turnoff, the
upper MOSFET was carrying channel current. During the
turnoff, current stops flowing in the upper MOSFET and is
picked up by the lower MOSFET. Any inductance in the
switched current path generates a large voltage spike during
the switching interval. Careful component selection, tight
layout of the critical components, and short, wide circuit
traces minimize the magnitude of voltage spikes. Contact
Intersil
for evaluation board drawings of the component
placement and printed circuit board.
There are two sets of critical components in a DC-DC
converter using a HIP6301 controller and a HIP6601B gate
driver. The power components are the most critical because
they switch large amounts of energy. Next are small signal
components that connect to sensitive nodes or supply critical
bypassing current and signal coupling.
The power components should be placed first. Locate the
input capacitors close to the power switches. Minimize the
length of the connections between the input capacitors, C
IN
,
and the power switches. Locate the output inductors and
output capacitors between the MOSFETs and the load.
Locate the gate driver close to the MOSFETs.
The critical small components include the bypass capacitors
for VCC and PVCC on the gate driver ICs. Locate the bypass
capacitor, C
BP
, for the HIP6301 controller close to the
device. It is especially important to locate the resistors
associated with the input to the amplifiers close to their
respective pins, since they represent the input to feedback
amplifiers. Resistor R
T
, that sets the oscillator frequency
should also be located next to the associated pin. It is
especially important to place the R
SEN
resistor(s) at the
respective terminals of the HIP6301.
A multi-layer printed circuit board is recommended. Figure 11
shows the connections of the critical components for one output
channel of the converter. Note that capacitors C
IN
and C
OUT
could each represent numerous physical capacitors. Dedicate
one solid layer, usually the middle layer of the PC board, for a
ground plane and make all critical component ground connections
I
SAMPLE
-------
-----------------------------------------------------------------------------------
V
IN
(
)
V
CORE
3V
2
–
+
IN
=
I
SENSE
(
------------------------------------------------------------------
)
r
Q2
(
)
=
R
ISEN
I
------------------------------------------------------------------
(
)
r
Q2
(
)
=
50
100
10
20
CHANNEL OSCILLATOR FREQUENCY, F
SW
(kHz)
FIGURE 10. RESISTANCE R
T
vs FREQUENCY
200
500 1,000
5,000 10,000
2,000
1
2
5
10
20
50
100
200
500
1,000
R
T
)
HIP6301
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HIP6301CBZ-T | Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller |
| HIP6301EVAL2 | Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller |
| HIP6301 | Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller(微處理器核心電壓穩(wěn)壓多相沖跳脈寬調(diào)制控制器) |
| HIP6301CB | Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller |
| HIP6301CB-T | Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HIP6301CBZ-T | 功能描述:電流型 PWM 控制器 FLEXIBLE 2-4 PHS SYNCH BUCK CNTRLR RoHS:否 制造商:Texas Instruments 開關(guān)頻率:27 KHz 上升時(shí)間: 下降時(shí)間: 工作電源電壓:6 V to 15 V 工作電源電流:1.5 mA 輸出端數(shù)量:1 最大工作溫度:+ 105 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSSOP-14 |
| HIP6301EVAL1 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller |
| HIP6301EVAL2 | 功能描述:電源管理IC開發(fā)工具 HIP6301 EVAL BRD RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V |
| HIP6301V | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller |
| HIP6301VCB | 功能描述:IC REG CTRLR BUCK PWM 20-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 切換控制器 系列:- 標(biāo)準(zhǔn)包裝:4,000 系列:- PWM 型:電壓模式 輸出數(shù):1 頻率 - 最大:1.5MHz 占空比:66.7% 電源電壓:4.75 V ~ 5.25 V 降壓:是 升壓:無 回掃:無 反相:無 倍增器:無 除法器:無 Cuk:無 隔離:無 工作溫度:-40°C ~ 85°C 封裝/外殼:40-VFQFN 裸露焊盤 包裝:帶卷 (TR) |
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