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參數(shù)資料
| 型號： | HIP6004ACB |
| 廠商： | HARRIS SEMICONDUCTOR |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | Buck and Synchronous-Rectifier (PWM) Controller and Output Voltage Monitor |
| 中文描述： | SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO20 |
| 文件頁數(shù)： | 7/12頁 |
| 文件大?。?/td> | 159K |
| 代理商： | HIP6004ACB |
2-68
For an equation for the ripple current see the section under component guidelines titled ‘Output Inductor Selection’
.
A small ceramic capacitor should be placed in parallel with
R
OCSET
to smooth the voltage across R
OCSET
in the
presence of switching noise on the input voltage.
Output Voltage Program
The output voltage of a HIP6004A converter is
programmed to discrete levels between 1.8V
DC
and
3.5V
DC
. The voltage identification (VID) pins program an
internal voltage reference (DACOUT) with a TTL-
compatible 5-bit digital-to-analog converter (DAC). The
level of DACOUT also sets the PGOOD and OVP
thresholds. Table 1 specifies the DACOUT voltage for the
32 different combinations of connections on the VID pins.
The output voltage should not be adjusted while the
converter is delivering power. Remove input power before
changing the output voltage. Adjusting the output voltage
during operation could toggle the PGOOD signal and
exercise the overvoltage protection.
All VID pin combinations resulting in a 0V output setting
activate the Power-On Reset function, disable the gate drive
circuitry and output a 0 logic at PGOOD pin.
Application Guidelines
Layout Considerations
As in any high frequency switching converter, layout is very
important. Switching current from one power device to
another can generate voltage transients across the
impedances of the interconnecting bond wires and circuit
traces. These interconnecting impedances should be
minimized by using wide, short printed circuit traces. The
critical components should be located as close together as
possible, using ground plane construction or single point
grounding.
Figure 5 shows the critical power components of the
converter. To minimize the voltage overshoot the
interconnecting wires indicated by heavy lines should be
part of ground or power plane in a printed circuit board. The
components shown in Figure 5 should be located as close
TABLE 1. OUTPUT VOLTAGE PROGRAM
PIN NAME
NOMINAL OUTPUT
VOLTAGE DACOUT
PIN NAME
NOMINAL OUTPUT
VOLTAGE DACOUT
VID4
VID3
VID2
VID1
VID0
VID4
VID3
VID2
VID1
VID0
0
1
1
1
1
0
1
1
1
1
1
0
0
1
1
1
0
0
1
1
1
1
0
2.1
0
1
1
0
1
0
1
1
1
0
1
2.2
0
1
1
0
0
0
1
1
1
0
0
2.3
0
1
0
1
1
0
1
1
0
1
1
2.4
0
1
0
1
0
0
1
1
0
1
0
2.5
0
1
0
0
1
0
1
1
0
0
1
2.6
0
1
0
0
0
0
1
1
0
0
0
2.7
0
0
1
1
1
0
1
0
1
1
1
2.8
0
0
1
1
0
0
1
0
1
1
0
2.9
0
0
1
0
1
1.80
1
0
1
0
1
3.0
0
0
1
0
0
1.85
1
0
1
0
0
3.1
0
0
0
1
1
1.90
1
0
0
1
1
3.2
0
0
0
1
0
1.95
1
0
0
1
0
3.3
0
0
0
0
1
2.00
1
0
0
0
1
3.4
0
0
0
0
0
2.05
1
0
0
0
0
3.5
NOTE: 0 = connected to GND or V
SS
, 1 = connected to V
DD
through pull-up resistors.
PGND
L
O
C
O
LGATE
UGATE
PHASE
Q
1
Q
2
D
2
V
IN
V
OUT
RETURN
HIP6004A
C
IN
L
FIGURE 5. PRINTED CIRCUIT BOARD POWER AND
GROUND PLANES OR ISLANDS
HIP6004A
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HIP6004ACB-T | 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel 制造商:Harris Corporation 功能描述: |
| HIP6004B | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Buck and Synchronous-Rectifier (PWM) Controller and Output Voltage Monitor |
| HIP6004B_03 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Buck and Synchronous-Rectifier (PWM) Controller and Output Voltage Monitor |
| HIP6004BCB | 功能描述:IC CTRLR PWM VOLTAGE MON 20-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 專用型 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,000 系列:- 應用:電源，ICERA E400，E450 輸入電壓:4.1 V ~ 5.5 V 輸出數(shù):10 輸出電壓:可編程 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:42-WFBGA，WLCSP 供應商設(shè)備封裝:42-WLP 包裝:帶卷 (TR) |
| HIP6004BCB-T | 功能描述:IC CTRLR PWM VOLTAGE MON 20-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 專用型 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,000 系列:- 應用:電源，ICERA E400，E450 輸入電壓:4.1 V ~ 5.5 V 輸出數(shù):10 輸出電壓:可編程 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:42-WFBGA，WLCSP 供應商設(shè)備封裝:42-WLP 包裝:帶卷 (TR) |
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